COLLEGE OF ENGINEERING

  

ZHIJIAN (ZJ) PEI

 

Professor

2011 Durland Hall

Manhattan, KS 66506–5101

785–532–3436

785–532–3738 fax

E–mail: zpei@ksu.edu
 
 

Home

Education

Appointments

Courses taught at KSU

Professional memberships

Other scholarly activities

Awards and honors

Funded research projects

Publications

Research associates

   

FUNDED RESEARCH PROJECTS AND CONTRACTS

 

           Summary of Grants and Contracts

National Science Foundation

$1,724,185

Industry and National Lab

$825,525

AMI and KSU

$151,119

Total

$2,700,829

 

  1. NSF (National Science Foundation), “CAREER: Fundamental research on silicon wafer fine grinding to foster a quantum leap in manufacturing of silicon wafers” (2/2004 – 1/2010).

  2. NSF, "Collaborative Research: Fundamental research on titanium drilling with rotary ultrasonic machining” (7/2009 – 6/2012). Co-PI: J.G. Sun (Argonne National Laboratory).

  3. NSF, “SGER: Exploratory research on solid carriers for manufacturing algae biofuels in the ocean” (9/2008 – 2/2010). Co-PI: W.Q. Yuan (KSU).

  4. NSF, “Innovative laser–based techniques for characterization of subsurface cracks in semiconductor wafers” (9/2005 – 8/2010). Co–PI: J.G. Sun (Argonne National Laboratory).

  5. NSF, “Workshop/Collaborative Research: 2010 NSF CAREER Proposal Writing Workshop; Georgia Institute of Technology; Atlanta, Georgia; March 25-26, 2010” (10/2009 – 9/2010).

  6. NSF, “Student Participation in the 2009 NSF Civil, Mechanical and Manufacturing Innovation Grantees and Research Conference; June 22-25, 2009; Honolulu, Hawaii” (11/2008 – 10/2010).

  7. NSF, “Workshop/Collaborative Research: 2009 NSF CAREER Proposal Writing Workshop; George Mason University; Arlington, Virginia; March 12-13, 2009” (8/2008 – 7/2010).

  8. NSF, “Workshop/Collaborative Research: 2008 NSF CAREER Proposal Writing Workshop; March 27 and 28, 2008; Northwestern University; Evanston, Illinois” (2/2008 – 1/2010).

  9. NSF, “Workshop: NSF Proposal Writing Workshop, August 22 and 23, 2007, University of Alaska” (6/2007 – 5/2010). Co-PI: J. Twomey (Wichita State University).

  10. Boeing, “Ultrasonic drilling testing” (2/2006 – 12/2009).

  11. Crystal Technology, Inc., “Development of advance fabrication process of lithium niobate” (4/2007 – 12/2009).

 

Completed projects:

  1. NSF, “Soft–pad grinding of wire–sawn silicon wafers” (9/2002 – 8/2006). Co–PIs: X.J. Xin (KSU), and S. Ostapenko (University of South Florida).

  2. NSF, “Workshops: 2007 NSF CAREER Proposal Writing Workshops: Hawaii Tokai International College (Honolulu), March 23, 2007; and University of Hawaii – Hilo, March 26, 2007” (12/2006 – 11/2007). Co-PI: W. Steiner (University of Hawaii – Hilo).

  3. NSF, “Workshop: NSF CAREER Proposal Writing Workshop; Wichita State University, Wichita, Kansas; April 6, 2006” (2/2006 – 1/2008).

  4. SME (Society of Manufacturing Engineers) 2002 Research Initiation Award, “Exploration of new territories for rotary ultrasonic machining” (5/2002 – 12/2003). Co–PI: S. Hanna (KSU).

  5. Argonne National Laboratory/Department of Energy, “Elastic optical scattering” (4/2005 – 8/2005).

  6. Argonne National Laboratory/Department of Energy, “Laser–based techniques to detect defects and machining damage in ceramic components and silicon wafers” (6/2003 – 6/2005).

  7. Argonne National Laboratory/Department of Energy, “Laser scattering measurement of subsurface damage in silicon wafers and ceramic materials” (5/2002 – 12/2002).

  8. MEMC Electronic Materials, Inc., “Modeling of wafering processes” (5/2006 – 8/2007).

  9. MEMC Electronic Materials, Inc., “Improved feedstock for polishing” (10/2004 – 9/2006).

  10. MEMC Electronic Materials, Inc., “Modeling of wafering processes” (6/2005 – 12/2005).

  11. Saint–Gobain, “Abrasive product development and finishing process development for ceramics/crystals”  (1/2007 – 9/2008).

  12. Saint–Gobain, “Machining of hard materials” (9/2005 – 8/2007).

  13. Strasbaugh, Inc., “Wafer grinding” (6/2003 – 12/2004).

  14. GE Panametrics, “Development of new ultrasonic techniques” (6/2003 – 8/2004).

  15. GE Panametrics, “Stress analysis on spoolpieces by finite element analysis (FEA)” (9/2003 – 12/2003). Co–PI: X.J. Xin (KSU).

  16. Advanced Manufacturing Institute, “Ultrasonic vibration assisted grinding” (7/2004 – 6/2005).

  17. Advanced Manufacturing Institute, “Ultrasonic vibration assisted grinding” (7/2003 – 6/2004).

  18. Advanced Manufacturing Institute, “Ultrasonic vibration assisted grinding” (7/2002 – 6/2003). Co–PI: S. Hanna (KSU).

  19. Advanced Manufacturing Institute, “Wafer grinding” (7/2001 – 6/2002).

  20. Advanced Manufacturing Institute, “Wafer grinding” (7/2000 – 6/2001).