COLLEGE OF ENGINEERING

  

ZHIJIAN (ZJ) PEI

 

Professor

2011 Durland Hall

Manhattan, KS 66506–5101

785–532–3436

785–532–3738 fax

E–mail: zpei@ksu.edu
 
 

Home

Education

Appointments

Courses taught at KSU

Professional memberships

Other scholarly activities

Awards and honors

Funded research projects

Publications

Research associates

   

SUMMARY OF PUBLICATIONS

 

 

 

Cumulative

At KSU

Journals

71

64

Peer-Reviewed Proceedings

52

48

Conference Proceedings

40

32

Educational Papers/Presentations

10

10

Presentations & Invited Talks

35

34

Books

2

 2

Book Chapters

5

 4

Patents

4

 

Book Review

1

1

PhD Dissertations Directed

4

4

MS Theses Directed

4

4

Total

228

203

            SCI: 43; EI: 90 (as of October, 2009)

 

JOURNAL PUBLICATIONS 

  1. E, X.Y., Pei, Z.J., and Schmidt, K.A., “Ice cream: foam formation and stabilization - a review,” accepted to appear in Food Reviews International.

  2. Liu, Z.P., Sun, J.G., and Pei, Z.J., “Cross-polarization confocal imaging of subsurface flaws in silicon nitride,” accepted to appear in International Journal of Applied Ceramic Technology.

  3. Cao, J., Yuan, W.Q., Pei, Z.J., Davis, T., Cui, Y., and Beltran, M., 2010, "Feasibility study of a mechanical-biological energy manufacturing system," accepted to appear in Journal of Manufacturing Science and Engineering, Vol. 132, No. 1.

  4. Shen, Y., Yuan, W.Q., Pei, Z.J., Wu, Q., and Mao, E.R., 2009, “Microalgae mass production methods,” Transactions of the ASABE (an International Journal of the American Society of Agricultural and Biological Engineers), Vol. 52, No. 4, pp. 1275-1287.

  5. Shen, Y., Pei, Z.J., Yuan, W.Q., and Mao, E.R., 2009, “Effect of nitrogen and extraction method on algae lipid yield,” International Journal of Agricultural and Biological Engineering, Vol. 2, No. 1, pp. 51-57.

  6. Shen, Y., Yuan, W.Q., Pei, Z.J., and Mao, E.R., 2009, “Heterotrophic culture of Chlorella protothecoides in various nitrogen sources for lipid production,” Applied Biochemistry and Biotechnology, available online http://www.springerlink.com/content/h5w3h868025u333r/.

  7. Wang, Q.G., Cong, W.L., Pei, Z.J., Gao, H., and Kang, R.K., 2009, “Rotary ultrasonic machining of potassium dihydrogen phosphate (KDP) crystal: an experimental investigation on surface roughness,” Journal of Manufacturing Processes, doi:10.1016/j.jmapro.2009.09.001.

  8. Wang, Q.G., Pei, Z.J., Gao, H., Churi, N., and Kang, R.K., 2009, “Rotary ultrasonic machining of potassium dihydrogen phosphate (KDP) crystal: an experimental investigation,” International Journal of Mechatronics and Manufacturing Systems, Vol. 2, No. 4, pp. 414-426.

  9. Qin, N., Pei, Z.J., Fisher, G.R., and Liu, J., 2009, “Simultaneous double side grinding of silicon wafers: a review and analysis of experimental investigations,” Machining Science and Technology, Vol. 13, No. 3, pp. 285-316.

  10. Qin, N., Pei, Z.J., Treadwell, C., and Guo, D.M., 2009, “Physics-based predictive cutting force model in ultrasonic-vibration-assisted grinding for titanium drilling,” Journal of Manufacturing Science and Engineering, Vol. 131, No. 4, pp. 041011-1–041011-9.

  11. Churi, N.J., Pei, Z.J., Treadwell, C., and Shorter, D., 2009, “Rotary ultrasonic machining of dental ceramics,” International Journal of Machining and Machinability of Materials, Vol. 6, No. 3-4, pp. 270-284.

  12. Cong, W.L., Zhang, P.F., and Pei, Z.J., 2009, “Experimental investigations on material removal rate and surface roughness in lapping of substrate wafers: a literature review,” Key Engineering Materials, Vol. 404, pp. 23-31.

  13. Zeng, W.M., Xu, X.P., and Pei, Z.J., 2009, “Experimental investigation of tool wear in rotary ultrasonic machining of alumina,” Key Engineering Materials, Vol. 416, pp. 181-186.

  14. Liu, J.H., Pei, Z.J., and Fisher, G.R., 2009, “Wheel wear mechanisms for silicon grinding: a literature review,” International Journal of Machining and Machinability of Materials, Vol. 5, No. 1, pp. 60-79.

  15. Zhang, P.F., Churi, N.J., Pei, Z.J., and Treadwell C., 2008, “Mechanical drilling processes for titanium alloys: a literature review,” Machining Science and Technology, Vol. 12, No. 4, pp. 417-444.

  16. Shen, J.D., Pei, Z.J., and Lee, E.S., 2008, “Support vector fuzzy adaptive network in the modeling of material removal rate in rotary ultrasonic machining,” Journal of Manufacturing Science and Engineering, Vol. 130, No. 4, pp. 041005-1–041005-8.

  17. Shen, Y., Yuan, W.Q., Pei, Z.J., and Mao, E.R., 2008, “Culture of microalga botryococcus in livestock wastewater,”  Transactions of the ASABE (an International Journal of the American Society of Agricultural and Biological Engineers), Vol. 51, No. 4, pp. 1395–1400.

  18. Li, Z.C., Pei, Z.J., and Fisher, G.R., 2008, “Simultaneous double side grinding of silicon wafers: a mathematical model for the wafer shape,” International Journal of Nanomanufacturing, Vol. 2, No. 8, pp. 556-571.

  19. Li, Z.C., Pei, Z.J., and Fisher, G.R., 2008, “Simultaneous double side grinding of silicon wafers: a mathematical study on grinding marks,” International Journal of Abrasive Technology, Vol. 1, No. 3-4, pp. 287-301.

  20. Pei, Z.J., Fisher, G.R., and Liu, J., 2008, “Grinding of silicon wafers: a review from historical perspectives,” International Journal of Machine Tools and Manufacture, Vol. 48, No. 12-13, pp. 1297–1307.

  21. Wu, J., Sun, X.K., Pei, Z.J., Xin, X.J., and Simmelink, K., 2008, “Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments,” International Journal of Manufacturing Technology and Management, Vol. 13, No. 2–4, pp. 169–186.

  22. Zeng, W.M., Li, Z.C., Xu, X.P., Pei, Z.J., Liu, J.D., and Pi, J., 2008, “Experimental investigation of intermittent rotary ultrasonic machining,” Key Engineering Materials, Vol. 359-360, pp. 425–430.

  23. Churi, N.J., Pei, Z.J., and Treadwell, C., 2007, “Rotary ultrasonic machining of titanium alloy (Ti-6Al-4V): effects of tool variables,” International Journal of Precision Technology, Vol. 1, No. 1, pp. 85–96.

  24. Lu, W.K., Pei, Z.J., and Fisher, G.R., 2007, “A grinding-based manufacturing method for silicon wafers: decomposition analysis of wafer surfaces,” Machining Science and Technology, Vol. 11, No. 1, pp. 81–97.

  25. Lu, W.K., Pei, Z.J., and Sun, J.G., 2007, “Nondestructive evaluation methods for subsurface damage in silicon wafers: a literature review,” International Journal of Machining and Machinability of Materials, Vol. 2, No. 1, pp. 125–142.

  26. Liu, J.H., Pei, Z.J., and Fisher, G.R., 2007, “ELID grinding of silicon wafers: a literature review,” International Journal of Machine Tools and Manufacture, Vol. 47, No. 3–4, pp. 529–536.

  27. Liu, J.H., Pei, Z.J., and Fisher, G.R., 2007, “Grinding wheels for manufacturing of silicon wafers: a literature review,” International Journal of Machine Tools and Manufacture, Vol. 47, No. 1, pp. 1–13.

  28. Liu, J.H., Pei, Z.J., and Fisher, G.R., 2007, “Experimental investigations of silicon wafer grinding,” Key Engineering Materials, Vol. 329, pp. 361–366.

  29. Liu, J.H. Pei, Z.J., and Fisher, G.R, 2007, “Investigations of silicon wafer grinding using finite element analysis,” International Journal of Computer Applications in Technology, Vol. 29, No. 2–4, pp. 102–107.

  30. Churi, N.J., Pei, Z.J., Treadwell, C., and Shorter, D., 2007, “Rotary ultrasonic machining of silicon carbide: designed experiments,” International Journal of Manufacturing Technology and Management, Vol. 12, No. 1–3, pp. 284–298.

  31. Li, Z.C., Pei, Z.J., and Fisher, G.R., 2006, “Simultaneous double side grinding of silicon wafers: a literature review,” International Journal of Machine Tools and Manufacture, Vol. 46, No. 12–13, pp. 1449–1458.

  32. Li, Z.C., Cai, L.W., Pei, Z.J., and Treadwell, C., 2006, “Edge-chipping reduction in rotary ultrasonic machining of ceramics: finite element analysis and experimental verification,” International Journal of Machine Tools and Manufacture, Vol. 46, No. 12-13, pp. 1469–1477.

  33. Zhang, X.H., Pei, Z.J., and Fisher, G.R., 2006, “A grinding–based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers,” International Journal of Machine Tools and Manufacture, Vol. 46, No. 3-4, pp 397–403.

  34. Jiao, Y., Pei, Z.J., Lei, S., Lee, E.S., and Fisher, G.R., 2006, “A fuzzy adaptive network model for waviness removal in grinding of wire-sawn silicon wafers,” Journal of Manufacturing Science and Engineering, Vol. 128, No. 4, pp. 938–943.

  35. Churi, N.J., Pei, Z.J., and Treadwell, C., 2006, “Rotary ultrasonic machining of titanium alloy: effects of machining variables,” Machining Science and Technology, Vol. 10, No. 3, pp. 301–321.

  36.  Sun, W.P., Pei, Z.J., and Fisher, G.R., 2006, “A grinding-based manufacturing method for silicon wafers: generation mechanisms of central bumps on ground wafers,” Machining Science and Technology, Vol. 10, No. 2, pp. 219–233.

  37. Shen, J.D., Pei, Z.J., Lee, E.S., and Fisher, G.R., 2006, “Modeling and analysis of waviness reduction in soft-pad grinding of wire-sawn silicon wafers by support vector regression,” International Journal of Production Research,  Vol. 44, No. 13, pp. 2605–2623.

  38. Lu, W.K., Pei, Z.J., and Sun, J.G., 2006, “Subsurface damage measurement in silicon wafers with cross-polarization confocal microscopy,” International Journal of Nanomanufacturing, Vol. 1, No. 2, pp. 272-282.

  39. Zeng, W.M., Xu, X.P., and Pei, Z.J., 2006, “Rotary ultrasonic machining of advanced ceramics,” Materials Science Forum, Vol. 532-533, pp. 361-364

  40. Y. Chen, Y., Pei, Z.J., and Treadwell, C., 2006, “Investigations on edge chipping in rotary ultrasonic machining using finite element analysis,” Materials Science Forum, Vol. 532-533, pp. 969-972.

  41. Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., 2005, “Rotary ultrasonic machining of ceramic matrix composites: feasibility study and designed experiments,” International Journal of Machine Tools and Manufacture, Vol. 45, No. 12–13, pp. 1402–1411.

  42. Zeng, W.M., Li, Z.C., Pei, Z.J., and Treadwell, C., 2005, “Experimental observation of tool wear in rotary ultrasonic machining of advanced ceramics,” International Journal of Machine Tools and Manufacture, Vol. 45, No. 12–13, pp. 1468–1473.

  43. Pei, Z.J., Fisher, G.R., Bhagavat, M., and Kassir, S., 2005, “A grinding–based manufacturing method for silicon wafers: an experimental investigation,” International Journal of Machine Tools and Manufacture, Vol. 45, No. 10, pp. 1140–1151.

  44. Sun, W.P., Pei, Z.J., and Fisher, G.R., 2005, “Fine grinding of silicon wafers: effects of chuck shape on grinding marks,” International Journal of Machine Tools and Manufacture, Vol. 45, No. 6, pp. 673–686.

  45. Sun, W.P., Pei, Z.J., and Fisher, G.R., 2005, “Fine grinding of silicon wafers: machine configurations for spindle angle adjustments,” International Journal of Machine Tools and Manufacture, Vol. 45, No. 1, pp. 51–61.

  46. Jiao, Y., Liu, W.J., Pei, Z.J., Xin, X.J., and Treadwell, C., 2005, “Study on edge chipping in rotary ultrasonic machining on ceramics: an integration of designed experiment and FEM analysis,” Journal of Manufacturing Science and Engineering, Vol. 127, No. 4, pp. 752–758.

  47. Jiao, Y., Pei, Z.J., Lei, S., Lee, E.S., and Fisher, G.R., 2005, “Fuzzy adaptive network in machining process modeling: dimensional error prediction for turning operations,” International Journal of Production Research, Vol. 43, No. 14–15, pp. 2931–2948.

  48. Sun, X.K., Xin, X.J., and Pei, Z.J., 2005, “Finite element analysis of die–strength testing configurations for thin semiconductor wafers,” Journal of Electronic Packaging, Vol. 127, No. 2, pp. 189–192.

  49. Jiao, Y., Hu, P., Pei, Z.J., and Treadwell, C., 2005, “Rotary ultrasonic machining of ceramics: design of experiments,” International Journal of Manufacturing Technology and Management, Vol. 7, No. 2–4, pp. 192–206.

  50. Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., 2005, “Development of an innovative coolant system for rotary ultrasonic machining,” International Journal of Manufacturing Technology and Management, Vol. 7, No. 2–4, pp. 318–328.

  51. Jiao, Y., Lei, S., Pei, Z.J., and Lee, E.S., 2004, “Fuzzy adaptive networks in machining process modeling: surface roughness prediction for turning operations,” International Journal of Machine Tools and Manufacture, Vol. 44, No. 15, pp. 1643–1651.

  52. Sun, W.P., Pei, Z.J., and Fisher, G.R., 2004, “Fine grinding of silicon wafers: a mathematical model for the wafer shape,” International Journal of Machine Tools and Manufacture, Vol. 44, No. 7–8, pp. 707–716.

  53. Pei, Z.J., Kassir, S., Bhagavat, M., and Fisher, G.R., 2004, “An experimental investigation into soft–pad grinding of wire–sawn silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 44, No. 2–3, pp. 297–304.

  54. Sun, X.K., Pei, Z.J., Xin, X.J., and Fouts, M., 2004, "Waviness removal in grinding of wire–sawn silicon wafers: 3D finite element analysis with designed experiments," International Journal of Machine Tools and Manufacture, Vol. 44, No. 1, pp. 11–19.

  55. Xin, X.J., Pei, Z.J., and Liu, W.J., 2004, “Finite element analysis on soft–pad grinding of wire–sawn silicon wafers,” Journal of Electronic Packaging, Vol. 126, No. 2, pp. 177–185.

  56. Sun, X.K., Pei, Z.J., and Xin, X.J., 2004, “Waviness removal in grinding of wire–sawn silicon wafers: three–dimensional finite element analysis,” International Journal of Advanced Manufacturing Systems, Vol. 7, No. 2, pp. 21-30.

  57. Chidambaram, S., Pei, Z.J., and Kassir, S., 2003, “Fine grinding of silicon wafers: a mathematical model for grinding marks,” International Journal of Machine Tools and Manufacture, Vol. 43, No. 15, pp. 1595–1602.

  58. Chidambaram, S., Pei, Z.J., and Kassir, S., 2003, “Fine grinding of silicon wafers: a mathematical model for the chuck shape,” International Journal of Machine Tools and Manufacture, Vol. 43, No. 7, pp. 739–746.

  59. Pei, Z.J., Xin, X.J., and Liu, W.J., 2003, “Finite element analysis for grinding of wire–sawn silicon wafers: a designed experiment,” International Journal of Machine Tools and Manufacture, Vol. 43, No. 1, pp. 7–16.

  60. Pei, Z.J., 2002, “A Study on surface grinding of 300 mm silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 42, No. 3, pp. 385–393.

  61. Pei, Z.J., and Strasbaugh, A., 2002, “Fine grinding of silicon wafers: designed experiments,” International Journal of Machine Tools and Manufacture, Vol. 42, No. 3, pp. 395–404.

  62. Liu, W.J., Pei, Z.J., and Xin, X.J., 2002, “Finite element analysis for grinding and lapping of wire–sawn silicon wafers,” Journal of Materials Processing Technology, Vol. 129, No. 1–3, pp. 2–9.

  63. Hu, P., Zhang, J.M., Pei, Z.J., and Treadwell, C., 2002, “Modeling of material removal rate in rotary ultrasonic machining: designed experiments,” Journal of Materials Processing Technology, Vol. 129, No. 1–3, pp. 339–344.

  64. Pei, Z.J., and Strasbaugh, A., 2001, “Fine grinding of silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 41, No. 5, pp. 659–672.

  65. Pei, Z.J., and Ferreira, P.M., 1999, “An experimental investigation of rotary ultrasonic face milling,” International Journal of Machine Tools and Manufacture, Vol. 39, No. 8, pp. 1327–1344.

  66. Pei, Z.J., Billingsley, S.R., and Miura, S, 1999, “Grinding–induced subsurface cracks in silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 39, No. 7, pp. 1103–1116.

  67. Pei, Z.J, and Ferreira, P.M., 1998, “Modeling of ductile mode material removal in rotary ultrasonic machining,” International Journal of Machine Tools and Manufacture, Vol. 38, No. 10–11, pp. 1399–1418.

  68. Pei, Z.J., Prabhakar, D., Ferreira, P.M., and Haselkorn, M., 1995, “A mechanistic approach to the prediction of material removal rates in rotary ultrasonic machining,” Journal of Engineering for Industry, Vol. 117, No. 2, pp. 142–151.

  69. Pei, Z.J., Ferreira, P.M., Kapoor, S.G., and Haselkorn, M., 1995, “Rotary ultrasonic machining for face milling of ceramics," International Journal of Machine Tools and Manufacture, Vol. 35, No. 7, pp. 1033–1046.

  70. Pei, Z.J., Ferreira, P.M., and Haselkorn, M., 1995, “Plastic flow in rotary ultrasonic machining of ceramics,” Journal of materials Processing Technology, Vol. 48, No. 1–4, pp. 771–777.

  71. Rubenstein, C., Lau, W.S., Pei, Z.J., and Wang, M., 1989, “The torque and thrust arising from contact at the lips in spade drilling of ductile metals,” International Journal of Machine Tools and Manufacture, Vol. 29, No. 3, pp. 453–467.

 

<Return to the top>

 

 

PUBLICATIONS IN PEER–REVIEWED TRANSACTIONS AND PROCEEDINGS 

  1. Pei, Z.J., Wang, D.H., and Clark, R., 2009, “Ultrasonic vibration assisted pelleting of cellulosic biomass: a preliminary experiment,” CD-ROM Proceedings of the 2009 International Manufacturing Science & Engineering Conference (MSEC), MSEC 2009, October 4-7, 2009, West Lafayette, IN, USA.

  2. Cong, W.L., Zhang, P.F., and Pei, Z.J., 2009, “Experimental investigations on flatness and subsurface damage in lapping of substrate wafers: a literature review,” CD-ROM Proceedings of 2009 International Manufacturing Science & Engineering Conference (MSEC), MSEC 2009, October 4-7, 2009, West Lafayette, IN, USA.

  3. Wu, J.Q., Cong, W.L., Williams, R.E., and Pei, Z.J., 2009, “Stochastic modeling and analysis of rotary ultrasonic machining,” CD-ROM Proceedings of the 2009 International Manufacturing Science & Engineering Conference (MSEC), MSEC 2009, October 4-7, 2009, West Lafayette, IN, USA.

  4. Qin, N., Pei, Z.J., Guo, D.M., 2009, “Ultrasonic-vibration-assisted grinding of titanium: cutting force modeling with design of experiments,” CD-ROM Proceedings of the 2009 International Manufacturing Science & Engineering Conference (MSEC), MSEC 2009, October 4-7, 2009, West Lafayette, IN, USA.

  5. Qin, N., Pei, Z.J., Guo, D.M., 2009, “Nanotopography in silicon wafer manufacturing: a literature review,” CD-ROM Proceedings of the 2009 International Manufacturing Science & Engineering Conference (MSEC), MSEC 2009, October 4-7, 2009, West Lafayette, IN, USA.

  6. Zhang, P.F., and Pei, Z.J., 2009, “An experimental investigation on subsurface damage in lapping of lithium niobate wafers,” CD-ROM Proceedings of the 2009 International Manufacturing Science & Engineering Conference (MSEC), MSEC 2009, October 4-7, 2009, West Lafayette, IN, USA.

  7. Yuan, W.Q., Y. Cui, and Pei, Z.J., 2009, “Algal cell-surface interaction: an overview and preliminary test,” CD-ROM Proceedings of the 2009 International Manufacturing Science & Engineering Conference (MSEC), MSEC 2009, October 4-7, 2009, West Lafayette, IN, USA.

  8. Cong W.L., Pei, Z.J., Van Vleet, E., and Wang, Q.G., 2009, “Surface roughness in rotary ultrasonic machining of stainless steels,” Proceedings of the IIE Annual Conference and Expo 2009 – Innovations Revealed, Miami, FL, May 30 – June 3, 2009.

  9. Cong W.L., Pei, Z.J., Churi, N., and Wang, Q.G., 2009, “Rotary ultrasonic machining of stainless steel: design of experiments,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 37, pp. 261–268.

  10. Sun, J.G., Liu, Z.P., Pei, Z.J., Phillips, N.S.L., and Jensen, J.A., 2009, “Optical methods for nondestructive evaluation of subsurface flaws in silicon nitride ceramics,” Ceramic Engineering and Science Proceedings, Vol. 29, No. 3, pp. 181-188, 2009, Corrosion, Wear, Fatigue, and Reliability of Ceramics - A Collection of Papers Presented at the 32nd International Conference on Advanced Ceramics and Composites.

  11. Cong, W.L., and Pei, Z.J., 2008, “Dry machining using vortex-tube generated cold air as coolant: a literature review,” CD-ROM Proceedings of the 2008 International Manufacturing Science & Engineering Conference (MSEC), MSEC 2008, October 7-10, 2008, Evanston, IL, USA.

  12. Wang, Q.G., Pei, Z.J., Gao, H., Churi, N., and Kang, R.K., 2008, “Experimental investigation on diamond drilling of potassium di-hydrogen phosphate (KDP) crystal,” CD-ROM Proceedings of the 2008 International Manufacturing Science & Engineering Conference (MSEC), MSEC 2008, October 7-10, 2008, Evanston, IL, USA.

  13. Halgeri, P., Pei, Z.J., Iyer K., Bishop, K., and Shehadeh, A., 2008, “ERP systems supporting lean manufacturing: a literature review,” CD-ROM Proceedings of the 2008 International Manufacturing Science & Engineering Conference (MSEC), MSEC 2008, October 7-10, 2008, Evanston, IL, USA.

  14. Churi, N.J., Pei, Z.J., and Treadwell, C., 2007, “Wheel wear mechanisms in rotary ultrasonic machining of titanium,” Proceedings of the 2007 ASME International Mechanical Engineering Congress and Exposition (IMECE 2007), Seattle, WA, November 11–15, Vol. 3, pp. 399-407.

  15. Zhang, X.H., Pei, Z.J., and Fisher, G.R., 2007, “Measurement methods of pad properties for chemical mechanical polishing,” Proceedings of the 2007 ASME International Mechanical Engineering Congress and Exposition (IMECE 2007), Seattle, WA, November 11–15, Vol. 3, pp. 517-522.

  16. Zhang, X.H., Pei, Z.J., and Fisher, G.R., 2007, “Finite element analysis of silicon wafer polishing: stress distributions and edge effects,” Proceedings of the International Symposium on Advances in Abrasive Technology (ISAAT2007), Dearborn, MI, September 25–28, pp. 193–199.

  17. Zhang, P.F., Pei, Z.J., and Treadwell, C., 2007, “Rotary ultrasonic machining of titanium alloy: experimental investigations,” Proceedings of the International Symposium on Advances in Abrasive Technology (ISAAT2007), Dearborn, MI, September 25–28, pp. 99–105.

  18. Zhang, X.H., Pei, Z.J., Esayanur, M., Bowers, G.L., and Fisher, G.R., 2007, “An experimental investigation of material removal rate in polishing of silicon wafers,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 35, pp. 17–24.

  19. Lu, W.K., and Pei, Z.J., 2007, “Decomposition analysis of machined surface topography,” Proceedings of the IIE Annual Conference and Expo 2007 - Industrial Engineering's Critical Role in a Flat World, Nashville, TN, May 19-23, 2007, pp. 1120-1125.

  20. Zhang, J.M., Sunanta, O., Sun, J.G., Pei, Z.J., Tseng, T.L., and Hu, P., 2007, “Experimental study and nondestructive evaluation on flat lapping,” Proceedings of the IIE Annual Conference and Expo 2007 - Industrial Engineering's Critical Role in a Flat World, Nashville, TN, May 19-23, 2007, pp. 1202-1207.

  21. Manchale, A., Zhang, J.M., Sun, J.G., Tseng, T.L., Pei, Z.J., and Hu, P., 2007, “Nondestructive evaluation technologies for composite materials,” Proceedings of the IIE Annual Conference and Expo 2007 - Industrial Engineering's Critical Role in a Flat World, Nashville, TN, May 19-23, 2007, pp. 1214-1219.

  22. Churi, N.J., Li, Z.C., Pei, Z.J., and Treadwell, C., 2005, “Rotary ultrasonic machining of titanium alloy: a feasibility study,” Proceedings of the 2005 ASME International Mechanical Engineering Congress and Exposition (IMECE 2005), Orlando, FL, November 5–11, Vol. 16-2, pp. 885-892.

  23. Zhang, X.H., Pei, Z.J., and Fisher, G.R., 2005, “Chemical mechanical polishing of silicon wafers: finite element analysis of wafer flatness,” Proceedings of the 2005 ASME International Mechanical Engineering Congress and Exposition (IMECE 2005), Orlando, FL, November 5–11, Vol. 16-2, pp. 893-900.

  24. Li, Z.C., Pei, Z.J., Zeng, W.M., Kwon, P., and Treadwell, C., 2005, “Preliminary experimental study of rotary ultrasonic machining on zirconia toughened alumina,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 33, pp. 89–96.

  25. Sun, W.P., Pei, Z.J., Lee, S.E., and Fisher, G.R., 2005, “Optimization of process parameters in manufacturing: an ELECTRE approach,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 33, pp. 187–194.

  26. Churi, N.J., and Pei, Z.J., 2004, “Experimental investigations into jig grinding,” Proceedings of the Seventh International Conference on Progress of Machining Technology, ICPMT'2004, Suzhou, China, December 8–11, pp.  219–224.

  27. Zeng, W.M., Li, Z.C., Pei, Z.J., and Treadwell, C., 2004, “Tool wear in rotary ultrasonic machining of advanced ceramics,” Proceedings of the Seventh International Conference on Progress of Machining Technology, ICPMT'2004, Suzhou, China, December 8–11, pp. 392–397.

  28. Li, Z.C., Cai, L.W., Pei, Z.J., and Treadwell, C., 2004, “Finite element simulation of rotary ultrasonic machining for advanced ceramics,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2004 (IMECE 2004), Anaheim, CA, November 13–19.

  29. Zeng, W.M., Li, Z.C., Pei, Z.J., and Treadwell, C., 2004, “Experimental investigation into rotary ultrasonic machining of alumina,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2004 (IMECE 2004), Anaheim, CA, November 13–19.

  30. Zhang, J.M., Sun, J.G., and Pei, Z.J., 2004, “Optical transmission properties of silicon wafers: theoretical analysis,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2004 (IMECE 2004), Anaheim, CA, November 13–19.

  31. Pei, Z.J., Fisher, G.R., and Strasbaugh, A., 2004, “Fine grinding of silicon wafer: benefits and technical barriers,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 32, pp. 479–488.

  32. Zhang, J.M., Sun, J.G., and Pei, Z.J., 2004, “Optical transmission properties of silicon wafers: experimental study,” Transactions of The North American Manufacturing Research Institution of SME, Vol. 32, pp. 471–478.

  33. Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., 2004, “Experimental study on rotary ultrasonic machining (RUM) of poly crystalline diamond compacts (PDC),” CD–ROM Proceedings of the 13th Annual Industrial Engineering Research Conference (IERC–2004), Houston, TX, May 15–19.

  34. Namala, S., Collins, R., and Pei, Z.J., 2004, “Implementing lean thinking concepts in high product mix manufacturing organizations,” Proceedings of the 13th Annual Industrial Engineering Research Conference (IERC–2004), Houston, TX, May 15–19, pp. 2451-2456.

  35. Zhang, J.M., Sun, J.G., and Pei, Z.J., 2003, “Application of laser scattering on detection of subsurface damage in silicon wafers,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2003 (IMECE 2003), Washington, DC, November 16–21, also in American Society of Mechanical Engineers (Publication) NDE, Vol. 24, 2003, pp. 15–24.

  36. Jiao, Y., Wu, J., Lei, S., Pei, Z.J., and Lee, S., 2003, “Application of fuzzy adaptive networks in manufacturing: waviness removal in grinding of wire–sawn silicon wafers,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2003 (IMECE 2003), Washington, DC, November 16–21.

  37. Zhang, J.M., Pei, Z.J., and Sun, J.G., 2003, “Calibration tests of laser scattering in subsurface damage measurements,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 31, pp. 563–570, also SME Technical Paper, MS03–213, Society of Manufacturing Engineers, Dearborn, MI.

  38. Zhang, J.M., Pei, Z.J., and Sun, J.G., 2003, “Experimental study on set–up parameters of laser scattering system,” CD–ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC–2003), Portland, OR, May 18–20.

  39. Hu, P., Wilson, C., and Pei, Z.J., 2003, “An experimental investigation into machinability of a refractory composite material,” CD–ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC–2003), Portland, OR, May 18–20.

  40. Hanna, S., Deines, T., Menon, S., Lei, S., and Pei, Z.J., 2003, “Experimental assessment of machining processes for a new composite material,” CD–ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC–2003), Portland, OR, May 18–20.

  41. Wu. J., Sun, X.K., Pei, Z.J., and Xin, X.J., 2003, “Soft–pad grinding of wire–sawn silicon wafers: finite element analysis using 25 factorial design,” CD–ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC–2003), Portland, OR, May 18–20.

  42.  Jiao, Y., Pei, Z.J., Lei, S., and, Lee, E.S., 2003, “Fuzzy adaptive networks in the modeling and forecasting of manufacturing processes,” CD–ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC–2003), Portland, OR, May 18–20.

  43. Pei, Z.J., and Strasbaugh, A., 2002, “Fine grinding of silicon wafers: grinding marks,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2002 (IMECE 2002), Vol. 2, New Orleans, LA, November 17–22.

  44. Xin, X.J., Pei, Z.J., and Liu, W.J., 2002, “Finite element analysis on soft–pad grinding of wire–sawn silicon wafers,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2002 (IMECE 2002), Vol. 2, New Orleans, LA, November 17–22.

  45. Zhang, J.M., Pei, Z.J., and Sun, J.G., 2002, "Measurement of subsurface damage in silicon wafers," Proceedings of the 6th International Conference on Progress of Machining Technology (ICPMT6), Xi'an, Shanxi, China, September 10–14, pp. 715–720.

  46. Chidambaram, S., Pei, Z.J., and Yu, Q.X., 2002, “Back grinding of silicon wafers,” Proceedings of the 6th International Conference on Progress of Machining Technology (ICPMT6), Xi'an, Shanxi, China, September 10–14, pp. 301–306.

  47. Zhang, J.M., Sun, J.G., and Pei, Z.J., 2002, “Subsurface damage measurement in silicon wafers by laser scattering,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 30, pp. 535–542, also SME Technical Paper, MS02–173, Society of Manufacturing Engineers, Dearborn, MI.

  48. Pei, Z.J., and Fisher, G., 2001, “Surface grinding in silicon wafer manufacturing,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 29, pp. 279–286, also SME Technical Paper, MR01–271, Society of Manufacturing Engineers, Dearborn, MI.

  49. Pei, Z.J., Prabhakar, D., Ferreira, P.M., and Haselkorn, M., 1995, “Rotary ultrasonic drilling and milling of ceramics,” Ceramic Transactions, Vol. 49, Manufacture of Ceramic Components, American Ceramic Society, Westerville, OH, pp. 185–196.

  50. Pei, Z.J., Khanna, N., and Ferreira, P.M., 1995, “An investigation into rotary ultrasonic machining of structural ceramics: a review,” Ceramic Engineering and Science Proceedings, Vol. 16, No. 1, pp. 259–278.

  51. Khanna, N., Pei, Z.J., and Ferreira, P.M., 1995, “An experimental investigation of rotary ultrasonic grinding of ceramic disks,” Technical Papers of the North American Manufacturing Research Institution of SME, pp. 67–72, also SME Technical Paper, MR95–141, Society of Manufacturing Engineers, Dearborn, MI.

  52. Prabhakar, D., Pei, Z.J., Ferreira, P.M., and Haselkorn, M., 1993, “A theoretical model for predicting material removal rates in rotary ultrasonic machining of ceramics,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 21, pp. 167–172.

 

<Return to the top>

 

 

 PUBLICATIONS IN CONFERENCE PROCEEDINGS AND INDUSTRIAL MAGAZINES

  1. Yuan, W.Q., Pei, Z.J., and Cui, Y., 2009, “Exploratory research on algae ocean farming for biofuel production,” ASABE paper number 096433, ASABE, St. Joseph, MI.

  2. Shen, Y., Yuan, W.Q., Pei, Z.J., and Mao, E.R., 2009, “Optimizing the wet-milling process for lipid extraction of microalgae Scendesmus dimorphus,” ASABE paper number 096005, ASABE, St. Joseph, MI.

  3. Shen, Y., Anderson, M., Ty, M., Pei, Z.J., and Yuan, W.Q., 2009, “Growing algae in photobioreactors for lipid production,” Mid-Central Conference of ASABE paper number MC09-506, Ames, IA.

  4. Zhang, P.F., Li, Z.C., Cong, W.L., and Pei, Z.J., 2009, “Fundamental research on silicon wafer fine grinding: 2008 progress report,” CD-ROM Proceedings of 2009 NSF Civil, Mechanical and Manufacturing Innovation Grantees and Research Conference; Honolulu, Hawaii, June 22-25.

  5. Liu, Z.P., Sun, J.G., and Pei, Z.J., 2009, “Cross-polarization confocal imaging of subsurface flaws," CD-ROM Proceedings of 2009 NSF Civil, Mechanical and Manufacturing Innovation Grantees and Research Conference; Honolulu, Hawaii, June 22-25.

  6. Yuan, W.Q., Cui, Y., and Pei, Z.J., 2009, “Immobilized algae culture for biofuel manufacturing: an overview and progress report,” CD-ROM Proceedings of 2009 NSF Civil, Mechanical and Manufacturing Innovation Grantees and Research Conference; Honolulu, Hawaii, June 22-25.

  7. Sun, J.G., Liu, Z.P., Pei, Z.J., Phillips, N.S.L., and Jensen, J.A., 2008, “Optical methods for nondestructive evaluation of subsurface flaws in silicon nitride ceramics,” Proceedings of the 32nd International Conference & Exposition on Advanced Ceramics & Composites, Daytona Beach, FL, January 27 – February 1.

  8. Liu, Z.P., Sun, J.G., and Pei, Z.J., 2008, “Experimental study on three light-scattering techniques for subsurface damage evaluation,” CD-ROM Proceedings of the 2008 NSF CMMI Engineering Research and Innovation Conference, Knoxville, TN, January 7-10.

  9. Zhang, P.F., Pei, Z.J., and Fisher, G.R, 2008, “Fundamental research on silicon wafer fine grinding: 2007 progress report,” CD-ROM Proceedings of the 2008 NSF CMMI Engineering Research and Innovation Conference, Knoxville, TN, January 7-10.

  10. Li, Z.C., Pei, Z.J., Sisco, T., Micale, A.C., and Treadwell, C., 2007, “Experimental study on rotary ultrasonic machining of graphite/epoxy panel,” Proceedings of the ASPE 2007 Spring Topical Meeting on Vibration Assisted Machining Technology, Chapel Hill, NC, April 16–17, pp. 52–57.

  11. Churi, N.J., Pei, Z.J., and Treadwell, C., 2007, “Experimental investigations on rotary ultrasonic machining of hard-to-machine materials,” Materials Processing under the Influence of External Fields, Proceedings of  the 2007 TMS Annual Meeting & Exhibition, Orlando, FL, February 25 – March 1, edited by Q.Y. Han, G. Ludtka, Q.J. Zhai, the Minerals, Metals & Materials Society, pp. 139–144.

  12. Liu, J.H. Pei, Z.J., and Fisher, G.R, 2006, “Investigations of silicon wafer grinding using finite element analysis,” Advances in Abrasive Machining and Surface Technologies, Proceedings of the International Conference on Surface Finishing Technology and Surface Engineering (ICSFT2006), September 25-27, 2006, Edited by Hang Gao, Jun Wang, Ahuji Jin, and Dongming Guo, Frontiers of Design and Manufacturing, Sydney, Australia, pp. 387–394.

  13. Zhang, X.H., Pei, Z.J., and Xin, X.J., 2006, “Soft-pad grinding of wire-sawn wafers: 2005 progress report,” CD–ROM Proceedings of the 2006 NSF Design, Service and Manufacturing Grantees and Research Conference, St. Louis, MO, July 24–27.

  14. Liu, J.H., Pei, Z.J., and Fisher, G.R., 2006, “Fundamental research on silicon wafer fine grinding: 2005 progress report,” CD–ROM Proceedings of the 2006 NSF Design, Service and Manufacturing Grantees and Research Conference, St. Louis, MO, July 24–27.

  15. Lu, W.K., Pei, Z.J., and Sun, J.G., 2006, “Innovative laser-based techniques for characterization of subsurface cracks in semiconductor wafers: progress report,” CD–ROM Proceedings of the 2006 NSF Design, Service and Manufacturing Grantees and Research Conference, St. Louis, MO, July 24–27.

  16. Zhang, X.H., Pei, Z.J., Xin, X.J., and Sun, X.K., 2005, “Three–dimensional FEA of soft–pad grinding of wire–sawn silicon wafers: effects of pad parameters,” CD–ROM Proceedings of the 2005 NSF Design, Service and Manufacturing Grantees and Research Conference, Scottsdale, AZ, January 3–6.

  17. Sun, W.P., Pei, Z.J., and Fisher, G.R., 2005, “Fine grinding of silicon wafers: 2004 progress report,” CD–ROM Proceedings of the 2005 NSF Design, Service and Manufacturing Grantees and Research Conference, Scottsdale, AZ, January 3–6.

  18. Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., 2004, “Rotary ultrasonic machining (RUM) on ceramic matrix composites (CMC): Designed experiments,” Proceedings of the Fifth International Conference on High Temperature Ceramic Matrix Composites (HTCMC–5), Seattle, WA, September 12–16.

  19. Shen, J.D., Pei, Z.J., and Lee, E.S., 2004, “Support vector regression in the analysis of soft–pad grinding of wire–sawn silicon wafers,” Proceedings of the Joint Meeting of the International Conference on Cybernetics and Information Technologies, Systems and Applications (CITSA 2004) and the 10th International Conference on Information Systems Analysis and Synthesis (ISAS 2004), Orlando, FL, July 21–25.

  20. Pei, Z.J., Xin, X.J., and Sun, X.K., 2004, “Soft–pad grinding of 300 mm wire–sawn silicon wafers: effects of soft pad parameters,” Proceedings of the 6th International Conference on Frontiers of Design and Manufacturing, Xi’an, China, June 21–23.

  21. Zeng, W.M., Li, Z.C., Pei, Z.J., and Treadwell, C., 2004, “Rotary ultrasonic machining of advanced ceramics: effects of coolant,” Proceedings of the 6th International Conference on Frontiers of Design and Manufacturing, Xi’an, China, June 21–23.

  22. Li, Z.C., Treadwell, C., and Pei, Z.J., 2004, “Drilling small holes in hard–to–machine materials by rotary ultrasonic machining,” CD–ROM Proceedings of the WESTEC Conference–New Frontiers in Manufacturing Technology, Los Angeles, CA, March 22–25, also SME Technical Paper TP04PUB137, Society of Manufacturing Engineers, Dearborn, MI.

  23. Pei, Z.J., Xin, X.J., Liu, W., Wu, J., Sun, X.K., Simmelink, K., and Fouts, M., 2004, “Soft–pad grinding of wire–sawn silicon wafers: progress report,” CD–ROM Proceedings of the 2004 NSF Design, Service and Manufacturing Grantees and Research Conference, Dallas, TX, January 5–8.

  24. Xin, X.J., Sun, X.K., and Pei, Z.J., 2003, “Grinding of 300 mm silicon wafers: finite element analysis of waviness removal,” Proceedings of the International Conference on Leading Edge Manufacturing in 21th Century (LEM21), Niigata, Japan, November 3–6.

  25. Treadwell, C, and Pei, Z.J., 2003, “Machining ceramics with rotary ultrasonic machining,” Ceramic Industry, June 2003, pp. 39–42.

  26. Pei, Z.J., Strasbaugh, A., and Puthanangady, T., 2003, “Thermal aspects in grinding of silicon wafers,” Proceedings of the NSF Workshop on Research Needs in Thermal Aspects of Material Removal Processes, Stillwater, OK, June 10–12, pp. 375–380.

  27. Hu, P., Zhang, J.M., Jiao, Y., Pei, Z.J., and Treadwell, C., 2003, “Experimental investigation on coolant effects in rotary ultrasonic machining,” Proceedings of the NSF Workshop on Research Needs in Thermal Aspects of Material Removal Processes, Stillwater, OK, June 10–12, pp. 340–345.

  28. Jiao, Y., Hu, P., Pei, Z.J., Lei, S., and Lee, E.S., 2003, “Application of fuzzy adaptive networks in manufacturing: prediction of material removal rate in rotary ultrasonic machining,” Intelligent Engineering Systems Through Artificial Neural Networks, Vol. 13, Smart Engineering System Design: Neural Networks, Fuzzy Logic, Evolutionary Programming, Complex Systems and Artificial Life – Proceedings of the Artificial Neural Networks in Engineering Conference, St. Louis, MO, November 2–5, pp. 491–496.

  29. Wu, J., Liu, W.J., Sun, X.K., Xin, X.J., and Pei, Z.J., 2003, “Soft–pad grinding of wire–sawn silicon wafers: finite element analysis using 24 factorial design,” CD–ROM Proceedings of the 2003 NSF Design, Service and Manufacturing Grantees and Research Conference, Birmingham, AL, January 6–9.

  30. Xin, X.J., Liu, W.J., and Pei, Z.J., 2002, “Modeling of waviness reduction in silicon wafer grinding by finite element method,” Proceedings of the International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM 2002), Tempe, AZ, April 10–12, pp. 24–29.

  31. Chidambaram, S. and Pei, Z.J., 2002, “A predictive model for grinding mark patterns in semiconductor wafer grinding,” Proceedings of the International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM 2002), Tempe, AZ, April 10–12, pp. 30–35.

  32. Chidambaram, S. and Pei, Z.J., 2001, “A study of grinding marks in semiconductor wafer grinding,” Proceedings of the 16th American Society for Precision Engineering Annual Meeting, Arlington, VA, November 10–15, pp. 393–396.

  33. Fisher, G., and Pei, Z.J., 1998, “Challenges for 300 mm polished wafer manufacturers,” Silicon Wafer Symposium, Portland, OR, Sept 28–29, pp. J1–J9.

  34. Tricard, M., Kassir, S., Herron, P., and Pei, Z.J., 1998, “New abrasive trends in manufacturing of silicon wafers,” Silicon Machining Symposium, American Society For Precision Engineering, St. Louis, MO, April.

  35. Pei, Z.J., Khanna, N., and Ferreira, P.M., 1995, “A study on material removal mechanisms in rotary ultrasonic machining of ceramics,” Proceedings of the 11th International Symposium for ElectroMachining, ISEM–XI, Lausanne, Switzerland, April 17–21, pp. 839–848.

  36. Shirkey, P.R., Pei, Z.J., and Ferreira, P.M., 1994, “Application of stochastic geometry in characterizing random phenomena in material removal processes,” Proceedings of the First S. M Wu Symposium on Manufacturing Science, Evanston, IL, May 27–28, pp. 177–183.

  37. Pei, Z.J., and Lau, W.S., 1989, “A new model of v–cutting,” Proceedings of the Fourth International Conference on Metal Cutting, Non–Conventional Machining and Their Automation, April, Beijing, China, Vol. 1, pp. C197–202.

  38. Zhou, L.Y., Yu, Q.X., and Pei, Z.J., 1989, “Failure mechanism of the coated carbide tool,” Proceedings of the Fourth International Conference on Metal Cutting, Non–Conventional Machining and Their Automation, Beijing, China, April, Vol. 1, pp. C203–207.

  39. Rubenstein, C., Lau, W.S., Pei, Z.J., and Wang, M., 1989, “Evaluation of cutting forces in spade drill,” Proceedings of the Fourth International Conference on Metal Cutting, Non–Conventional Machining and Their Automation, Beijing, China, April, Vol. 2, pp. C245–262.

  40. Wang, Y.M., Pei, Z.J., and Shen, W.Q., 1987, “On the cutting performance of new types of home–made HSS,” Proceedings of the Third International Conference on Metal Cutting, Non–Conventional Machining and Their Automation, Nanjing, China, May, pp. 1–13.

 

<Return to the top>

 

 

 EDUCATIONAL PAPERS AND PRESENTATIONS

  1. Anthony, J.L., Pentz, J.L. and Pei, Z.J., 2007, “Experience of learning together as K-State LEA/RNers,” Presentation at the Fourth Annual K-State Teaching Renewal Retreat, Manhattan, KS, January 8.

  2. Pei, Z.J., 2006, “Using Hollywood movies as a supplementary tool to teach manufacturing processes,” CD-ROM Proceedings of the 2006 ASEE Annual Conference & Exposition, June 18-21, Chicago, IL. (This paper has received a best paper nomination.)

  3. Zhang, J.M., and Pei, Z.J., 2006, “Experience with interactive methods in manufacturing courses,” CD-ROM Proceedings of the 2006 ASEE Annual Conference & Exposition, June 18-21, Chicago, IL.

  4. Pei, Z.J., 2006, “Using Hollywood movies as a supplementary lecture tool,” Presentation at the Third Annual K-State Teaching Renewal Retreat, Manhattan, KS, January 9.

  5. Sun, W.P., Zhang, J.M., and Pei, Z.J., 2005, “Enhancement of students’ learning in large classes,” CD–ROM Proceedings of the 40th ASEE Midwest Section Conference and Workshops, Fayetteville, AR, September 14–16.

  6. Sun, W.P., Zhang, J.M., and Pei, Z.J., 2005, “Teaching lean manufacturing by learner-centered methods,” CD–ROM Proceedings of the 40th ASEE Midwest Section Conference and Workshops, Fayetteville, AR, September 14–16.

  7. Pei, Z.J., 2003, “Experience of using multimedia during classroom lectures,” CD–ROM Proceedings of the 38th ASEE Midwest Section Conference and Workshops, Rolla, MO, September 10–12.

  8. Pei, Z.J., and Mayfield, C., 2003, “Extension of classroom to a local manufacturing company,” CD–ROM Proceedings of the 38th ASEE Midwest Section Conference and Workshops, Rolla, MO, September 10–12.

  9. Deines, T., Hanna, S., Pei, Z.J., and Wilson, C., 2002, “Experience of innovations in a manufacturing process laboratory course,” CD–ROM Proceedings of the 37th ASEE Midwest Section Conference and Workshops, Norman, OK, September 12–13.

  10. Pei, Z.J., Hanna, S., Deines, T., and Lei, S., 2002, “Experience in technology–based instruction and active learning for a manufacturing course,” Transactions of the Committee of Manufacturing Engineering Chairs/Coordinators (COMEC), Vol. 1, pp. 38–45, also SME Technical Paper, ED02–259, Society of Manufacturing Engineers, Dearborn, MI.

 

<Return to the top>

 

 

CONFERENCE PRESENTATIONS AND POSTERS, AND INVITED TALKS 

  1. Cong, W.L., Zhang, P.F., Qin, N., Zhang, M., Song, X.X., Zhang, Q., Nottingham, N., Clark, R., Deines, T., Pei, Z.J., and Wang, D.H., 2009, “Ultrasonic vibration-assisted pelleting of cellulosic biomass for biofuel manufacturing,” Poster presentation at the 2009 International Manufacturing Science and Engineering Conference (MSEC), October 4-7, 2009, West Lafayette, IN, USA, MSEC2009-84432.

  2. Cao, J, Yuan, W.Q., Pei, Z.J., Davis, T., Cui, Y., and Beltran, M., 2009 “Effect of surface texture on algae growth,” The 59th CIRP General Assembly, August 23-29, 2009, Boston, MA.

  3. Pei, Z.J., 2009, “Lessons learned from my experience of writing CAREER proposals,” invited talk to a seminar at University of Connecticut, June 1.

  4. Pei, Z.J., 2009, “Lessons learned from my experience of writing CAREER proposals,” invited talk to a seminar at University of Massachusetts at Lowell, May 28.

  5. Pei, Z.J., 2008, “How my CAREER award helped my career,” presentation at the Coping With Your CAREER Award session, NSF CMMI Engineering Research and Innovation Conference, Knoxville, TN, January 7-10.

  6. Pei, Z.J., 2008, “Report on the NSF CAREER Proposal Writing Workshops,” presentation at the plenary session (Report out on workshops), NSF CMMI Engineering Research and Innovation Conference, Knoxville, TN, January 7-10.

  7. Pei, Z.J., and Treadwell, C., 2007, “Machining of ceramic matrix composites using ultrasonic vibration assisted diamond drilling,” presentation at Composites Manufacturing 2007 Conference/SME, Hilton Salt Lake City Center, Salt Lake City, Utah, April 10–12.

  8. Pei, Z.J., 2006, “CAREER award as a springboard,” presentation at the Coping With Your CAREER Award session, 2006 NSF Design, Service, and Manufacturing Grantees and Research Conference, St. Louis, MO, July 25.

  9. Pei, Z.J., 2006, “Silicon wafer grinding and rotary ultrasonic machining,” invited talk to the Key Laboratory for Advanced Ceramics and Machining Technology of Ministry of Education, School of Mechanical Engineering, Tianjin University, China, May 23.

  10. Pei, Z.J., 2006, “Tips on writing ‘high-quality’ journal papers,” invited talk to the Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education, School of Mechanical Engineering, Dalian University of Technology, China, May 20.

  11. Pei, Z.J., 2006, “Graduate Education at Kansas State University and silicon wafer grinding,” invited talk to the Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education, School of Mechanical Engineering, Dalian University of Technology, China, May 18.

  12. Pei, Z.J., 2006, “Engineering undergraduate education in the USA,” invited talk to School of Mechanical Engineering, Zhengzhou University, China, May 15.

  13. Pei, Z.J., 2006, “Challenges in grinding of silicon wafers,” invited talk to the Key Laboratory for Stone Machining of Fujian Province, School of Mechanical Engineering, Huaqiao University, Quanzhou, China, May 12.

  14. Pei, Z.J., 2006, “Manufacturing research and education in the USA,” invited talk to School of Mechanical Engineering, Zhengzhou University, China, May 11.

  15. Pei, Z.J., 2006, “Machine configurations for silicon wafer grinding,” Mechanical & Materials Engineering Symposium, Washington State University, Pullman, WA, April 13.

  16. Pei, Z.J., 2006, “My experience of writing CAREER proposals,” presentation at the 2006 NSF CAREER Proposal Writing Workshop, Wichita State University, Wichita, KS, April 6.

  17. Pei, Z.J., 2006, “Grinding wheels for manufacturing of silicon wafers: a literature review,” invited talk to MEMC Electronic Materials, Inc., St. Peters, MO, January 5.

  18. Pei, Z.J., 2005, “Advancement on silicon wafer grinding,” invited talk to Manufacturing Engineering Seminar, Worcester Polytechnic University, November 17.

  19. Lu, W.K., Pei, Z.J., and Fisher, G.R., 2005, “Decomposition analysis of surface features on ground silicon wafers,” presentation at the International Mechanical Engineering Congress and Exposition 2005 (IMECE 2005), Orlando, FL, November 6–11.

  20. Pei, Z.J., 2005, “Challenges in grinding of silicon wafers,” invited talk to Diamond Innovations, Inc., Worthington, OH, July 26.

  21. Pei, Z.J., 2005, “Research issues in wafer grinding and rotary ultrasonic machining,” presentation at the NSF Workshop on Science and Technologies for Manufacturing Machines and Processes, Lincoln, NE, July 19–21.

  22. Pei, Z.J., 2005, “Machine configurations for spindle angle adjustments in silicon wafer grinding,” invited talk to the Northboro Research and Development Center of Saint–Gobain, Northboro, MA, June 21.

  23. Pei, Z.J., 2005, “Central dimples and bumps on ground silicon wafers,” invited talk to the Northboro Research and Development Center of Saint–Gobain, Northboro, MA, May 26.

  24. Pei, Z.J., 2005, “Report on the NSF CAREER Proposal Writing Workshop held on November 13-14, 2004, Anaheim, CA,” presentation at the CAREER session, 2005 NSF Design, Service, and Manufacturing Grantees and Research Conference, Tempe, AZ, January 3.

  25. Pei, Z.J., 2004, “Presentation at the NSF CAREER Proposal Writing Workshop,” presentation at the 2004 NSF CAREER Proposal Writing Workshop, Anaheim, CA, November 13.

  26. S. Udayagiri, and Pei, Z.J., 2004, “Value stream analysis in a manufacturing company,” presentation at the INFORMS Annual Meeting, Denver, CO, October 24–27.

  27. Pei, Z.J., 2003, “Fine grinding of silicon wafer: benefits and challenges,” invited talk to Saint–Gobain Abrasives, Inc., Worcester, MA, August 7.

  28. Pei, Z.J., Hanna, S., and Liu, D., 2002, “Interventions and Kaizen events,” two–week long training at Shunde Special Transformer Works, Shunde, Guangdong, China, July 29 – August 9.

  29. Pei, Z.J., and Hanna, S., 2002, “Interventions,” invited talk to Beijing Zhongli Chemical Fiber Machinery Co., Ltd., Beijing, China, July 26.

  30. Pei, Z.J., 2002, “Technology–based instruction and active learning for a manufacturing course,” invited talk to the Industrial Engineering Department at Tsinghua University, Beijing, China, July 25.

  31. Pei, Z.J., 2002, “Challenges in fine grinding of silicon wafers,” invited talk to the Industrial Engineering Department at Tsinghua University, Beijing, China, July 25.

  32. Pei, Z.J., 2002, “Process–induced subsurface damage and waviness in silicon wafers,” invited talk to the Manufacturing Metrology Division of the Manufacturing Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, May 17.

  33. Pei, Z.J., and Strasbaugh, A., 2002, “Fine grinding of silicon wafers: past and future,” presentation at the ASPE 2002 Spring Topical Meeting – Progress in Precision, Raleigh, NC, April 17–18.

  34. Chidambaram, S., and Pei, Z.J., 2001, “Back grinding of silicon wafers: a review,” presentation at the 103rd American Ceramic Society Annual Meeting and Exposition, Indianapolis, IN, April 22–25.

  35. Pei, Z.J., Khanna, N., Ferreira, P.M., and Haselkorn, M., 1995, “Rotary ultrasonic face milling of magnesia stabilized zirconia,” presentation at the American Ceramic Society 97th Annual Meeting, Cincinnati, OH, April 30–May 3.

 

<Return to the top>

 

 

BOOKS 

  1. Pei, Z.J. (editor), 2007, “NSF CAREER Proposal Writing Tips,” Lulu, Inc. (ISBN: 978-1-4303-0697-9).

  2. Pei, Z.J. (editor), 2009, “Tips on Getting an Academic Position,” Lulu, Inc. (ISBN 978-0-557-05363-6).

 

<Return to the top>

 

 

BOOK CHAPTERS 

  1. Li, Z.C., Pei, Z.J., and Treadwell, C.,  2009, “Recent advances in rotary ultrasonic machining of ceramics,” an invited book chapter to appear in Developments in Ceramic Materials Research, edited by D. Rosslere, Nova Science Publishers, Inc., Hauppauge, NY.

  2. Zhang, J.M., Sun, J.G., and Pei, Z.J., 2009, “Evaluation of subsurface damage in nano and micromachining,” an invited book chapter to appear in Nano and Micro Machining, edited by J.P. Davim and M.J. Jackson, Hermes Publisher.

  3. Halgeri, P., McHaney, R., Pei, Z.J., 2009, “ERP systems supporting lean manufacturing in SMEs,” an invited book chapter to appear in Enterprise Information Systems for Business Integration in SMEs: Technological, Organizational and Social Dimensions, edited by Maria Manuela Cruz-Cunha, IGI Global.

  4. Pei, Z.J., Li, Z.C., and Fisher, G.R., 2007, “Grinding of silicon wafers in the nano-technology era,” an invited book chapter in Semiconductor Machining at the Micro-Nano Scale, edited by J.W. Yan and J. Patten, Transworld Research Network, Kerala, India, pp. 219–241.

  5. Ferreira, P.M, and Pei, Z.J., 1999, “Rotary ultrasonic machining of ceramics,” an invited book chapter in Machining of Ceramics and Components, edited by S. Jahanmir, M. Ramulu and P. Koshy, Marcel Dekker, Inc., New York, NY, pp. 525-549.

 

<Return to the top>

 

 

PATENTS 

  1. U.S. Patent 6,600,557, July 29, 2003, “Method for the detection of processing–induced defects in a silicon wafer” (with A. Stefanescu, H. Erk, and T. Doane).

  2. U.S. Patent 6,114,245, September 5, 2000, “Method of processing semiconductor wafers,” (with R. Vandamme, and Y. Xin).

  3. U.S. Patent 5,655,956, August 12, 1997, “Rotary ultrasonic grinding apparatus and process,” (with P.M. Ferreira and N. Khanna).

  4. US Patent Application (Serial No. 09/512,529), February 24, 2000, “A method of processing semiconductor wafers,” (with S. Miura, A. Desai, and H. Erk).

 

<Return to the top>

 

 

 BOOK REVIEW

  1. Pei Z.J., 2004, “The success of 7–eleven Japan: Discovering the secrets of the world's best–run convenience chain stores,” Journal of the Operational Research Society, Vol. 55, No. 1, p. 99.

 

<Return to the top>

 

 

 PHD DISSERTATIONS DIRECTED

  1. Zhang, X.H., 2007, “Finite element analysis and experimental investigation of polishing and grinding of silicon wafers”  (seven papers published from this research).

  2. Li, Z.C., 2006, “Modeling, analysis, and experimental investigations of grinding processes” (12 papers published from this research).

  3. Zhang, J.M., 2006, “Laser scattering techniques for subsurface damage measurements: system development, experimental investigation, and theoretical analysis” (nine papers published from this research).

  4. Sun, W.P., 2005, “Grinding of silicon wafers: wafer shape model and its applications” (six papers published from this research).

 

<Return to the top>

 

MS THESES DIRECTED

  1. Lu, W.K., 2007, “Surface and subsurface characterization of silicon wafers through feature decomposition and laser scattering” (five papers published from this research).

  2. Hu, P., 2004, “Exploration of new territories for rotary ultrasonic machining” (five papers published from this research).

  3. Wu, J., 2003, “Soft–pad grinding of wire–sawn silicon wafers: finite element analysis with designed experiments” (five papers published from this research).

  4. Chidambaram. S., 2002, “Mathematical models for predicting grinding marks and chuck shape in semiconductor wafer grinding” (five papers published from this research).

 

<Return to the top>