COLLEGE OF ENGINEERING

  

ZHIJIAN (ZJ ) PEI

 

Associate Professor

211 Durland Hall

Manhattan, KS 66506–5101

785–532–3436

785–532–3738 fax

E–mail: zpei@ksu.edu
 
 

Home

Education

Appointments

Courses taught at KSU

Professional memberships

Other scholarly activities

Awards and honors

Funded research projects

Publications

Research associates

   

SUMMARY OF PUBLICATIONS

 

 

 

Cumulative

At KSU

Journals

48

41

Peer-Reviewed Proceedings

31

27

Conference Proceedings

30

22

Educational Papers/Presentations

9

9

Presentations & Invited Talks

24

23

Book Chapters

1

 

Patents

4

 

Book Reviews

1

1

Dissertations Directed

6

6

Total

153

128

            SCI: 34; EI: 62 (as of November 10, 2006)

 

JOURNAL PUBLICATIONS 

  1. Lu, W.K., Pei, Z.J., and Sun, J.G., “Nondestructive evaluation methods for subsurface damage in silicon wafers: a literature review,” accepted to appear in International Journal of Machining and Machinability of Materials.

  2. Lu, W.K., Pei, Z.J., and Sun, J.G., “Subsurface damage measurement in silicon wafers with cross-polarization confocal microscopy,” accepted to appear in International Journal of Nanomanufacturing.

  3. Churi, N.J., Pei, Z.J., Treadwell, C., and Shorter, D., “Rotary ultrasonic machining of silicon carbide: designed experiments,” accepted to appear in International Journal of Manufacturing Technology and Management.

  4. Wu, J., Sun, X.K., Pei, Z.J., Xin, X.J., and Simmelink, K., "Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments," accepted to appear in International Journal of Manufacturing Technology and Management.

  5. Liu, J.H., Pei, Z.J., and Fisher, G.R., “Investigations of silicon wafer grinding using finite element analysis,” accepted to appear in International Journal of Manufacturing Technology and Management.

  6. Liu, J.H., Pei, Z.J., and Fisher, G.R., “ELID grinding of silicon wafers: a literature review,” accepted to appear in International Journal of Machine Tools and Manufacture.

  7. Liu, J.H., Pei, Z.J., and Fisher, G.R., 2007, “Grinding wheels for manufacturing of silicon wafers: a literature review,” International Journal of Machine Tools and Manufacture, Vol. 47, No. 1, pp. 1-13.

  8. Liu, J.H., Pei, Z.J., and Fisher, G.R., 2007, “Experimental investigations of silicon wafer grinding,” Key Engineering Materials, Vol. 329, pp. 361-366.

  9. Li, Z.C., Pei, Z.J., and Fisher, G.R., 2006, “Simultaneous double side grinding of silicon wafers: a literature review,” International Journal of Machine Tools and Manufacture, Vol. 46, No. 12-13, pp. 1449-1458.

  10. Li, Z.C., Cai, L.W., Pei, Z.J., and Treadwell, C., 2006, “Edge-chipping reduction in rotary ultrasonic machining of ceramics: finite element analysis and experimental verification,” International Journal of Machine Tools and Manufacture, Vol. 46, No. 12-13, pp. 1469-1477.

  11. Zhang, X.H., Pei, Z.J., and Fisher, G.R., 2006, “A grinding–based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers,” International Journal of Machine Tools and Manufacture, Vol. 46, No. 3-4, pp 397–403.

  12. Jiao, Y., Pei, Z.J., Lei, S., Lee, E.S., and Fisher, G.R., 2006, “A fuzzy adaptive network model for waviness removal in grinding of wire-sawn silicon wafers,” Journal of Manufacturing Science and Engineering. Vol. 128, No. 4, pp. 938-943.

  13. Churi, N.J., Pei, Z.J., and Treadwell, C., 2006, “Rotary ultrasonic machining of titanium alloy: effects of machining variables,” Machining Science and Technology, Vol. 10, No. 3, pp. 301-321.

  14.  Sun, W.P., Pei, Z.J., and Fisher, G.R., 2006, “A grinding-based manufacturing method for silicon wafers: generation mechanisms of central bumps on ground wafers,” Machining Science and Technology, Vol. 10, No. 2, pp. 219–233.

  15. Shen, J.D., Pei, Z.J., Lee, E.S., and Fisher, G.R., 2006, “Modeling and analysis of waviness reduction in soft-pad grinding of wire-sawn silicon wafers by support vector regression,” International Journal of Production Research,  Vol. 44, No. 13, pp. 2605–2623.

  16. Zeng, W.M., Xu, X.P., and Pei, Z.J., 2006, “Rotary ultrasonic machining of advanced ceramics,” Materials Science Forum, Vols. 532-533, pp. 361-364

  17. Y. Chen, Y., Pei, Z.J., and Treadwell, C., 2006, “Investigations on edge chipping in rotary ultrasonic machining using finite element analysis,” Materials Science Forum, Vols. 532-533, pp. 969-972.

  18. Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., 2005, “Rotary ultrasonic machining of ceramic matrix composites: feasibility study and designed experiments,” International Journal of Machine Tools and Manufacture, Vol. 45, Nos. 12–13, pp. 1402–1411.

  19. Zeng, W.M., Li, Z.C., Pei, Z.J., and Treadwell, C., 2005, “Experimental observation of tool wear in rotary ultrasonic machining of advanced ceramics,” International Journal of Machine Tools and Manufacture, Vol. 45, Nos. 12–13, pp. 1468–1473.

  20. Pei, Z.J., Fisher, G.R., Bhagavat, M., and Kassir, S., 2005, “A grinding–based manufacturing method for silicon wafers: an experimental investigation,” International Journal of Machine Tools and Manufacture, Vol. 45, No. 10, pp. 1140–1151.

  21. Sun, W.P., Pei, Z.J., and Fisher, G.R., 2005, “Fine grinding of silicon wafers: effects of chuck shape on grinding marks,” International Journal of Machine Tools and Manufacture. Vol. 45, No. 6, pp. 673–686.

  22. Sun, W.P., Pei, Z.J., and Fisher, G.R., 2005, “Fine grinding of silicon wafers: machine configurations for spindle angle adjustments,” International Journal of Machine Tools and Manufacture, Vol. 45, No. 1, pp. 51–61.

  23. Jiao, Y., Liu, W.J., Pei, Z.J., Xin, X.J., and Treadwell, C., 2005, “Study on edge chipping in rotary ultrasonic machining on ceramics: an integration of designed experiment and FEM analysis,” Journal of Manufacturing Science and Engineering, Vol. 127, No. 4, pp. 752–758.

  24. Jiao, Y., Pei, Z.J., Lei, S., Lee, E.S., and Fisher, G.R., 2005, “Fuzzy adaptive network in machining process modeling: dimensional error prediction for turning operations,” International Journal of Production Research, Vol. 43, No. 14–15, pp. 2931–2948.

  25. Sun, X.K., Xin, X.J., and Pei, Z.J., 2005, “Finite element analysis of die–strength testing configurations for thin semiconductor wafers,” Journal of Electronic Packaging, Vol. 127, No. 2, pp. 189–192.

  26. Jiao, Y., Hu, P., Pei, Z.J., and Treadwell, C., 2005, “Rotary ultrasonic machining of ceramics: design of experiments,” International Journal of Manufacturing Technology and Management, Vol. 7, Nos. 2–4, pp. 192–206.

  27. Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., 2005, “Development of an innovative coolant system for rotary ultrasonic machining,” International Journal of Manufacturing Technology and Management, Vol. 7, Nos. 2–4, pp. 318–328.

  28. Jiao, Y., Lei, S., Pei, Z.J., and Lee, E.S., 2004, “Fuzzy adaptive networks in machining process modeling: surface roughness prediction for turning operations,” International Journal of Machine Tools and Manufacture, Vol. 44, No. 15, pp. 1643–1651.

  29. Sun, W.P., Pei, Z.J., and Fisher, G.R., 2004, “Fine grinding of silicon wafers: a mathematical model for the wafer shape,” International Journal of Machine Tools and Manufacture, Vol. 44, Nos. 7–8, pp. 707–716.

  30. Pei, Z.J., Kassir, S., Bhagavat, M., and Fisher, G.R., 2004, “An experimental investigation into soft–pad grinding of wire–sawn silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 44, Nos. 2–3, pp. 297–304.

  31. Sun, X.K., Pei, Z.J., Xin, X.J., and Fouts, M., 2004, "Waviness removal in grinding of wire–sawn silicon wafers: 3D finite element analysis with designed experiments," International Journal of Machine Tools and Manufacture, Vol. 44, No. 1, pp. 11–19.

  32. Xin, X.J., Pei, Z.J., and Liu, W.J., 2004, “Finite element analysis on soft–pad grinding of wire–sawn silicon wafers,” Journal of Electronic Packaging, Vol. 126, No. 2, pp. 177–185.

  33. Sun, X.K., Pei, Z.J., and Xin, X.J., 2004, “Waviness removal in grinding of wire–sawn silicon wafers: three–dimensional finite element analysis,” International Journal of Advanced Manufacturing Systems, Vol. 7, No. 2, pp. 21-30.

  34. Chidambaram, S., Pei, Z.J., and Kassir, S., 2003, “Fine grinding of silicon wafers: a mathematical model for grinding marks,” International Journal of Machine Tools and Manufacture, Vol. 43, No. 15, pp. 1595–1602.

  35. Chidambaram, S., Pei, Z.J., and Kassir, S., 2003, “Fine grinding of silicon wafers: a mathematical model for the chuck shape,” International Journal of Machine Tools and Manufacture, Vol. 43, No. 7, pp. 739–746.

  36. Pei, Z.J., Xin, X.J., and Liu, W.J., 2003, “Finite element analysis for grinding of wire–sawn silicon wafers: a designed experiment,” International Journal of Machine Tools and Manufacture, Vol. 43, No. 1, pp. 7–16.

  37. Pei, Z.J., 2002, “A Study on surface grinding of 300 mm silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 42, No. 3, pp. 385–393.

  38. Pei, Z.J., and Strasbaugh, A., 2002, “Fine grinding of silicon wafers: designed experiments,” International Journal of Machine Tools and Manufacture, Vol. 42, No. 3, pp. 395–404.

  39. Liu, W.J., Pei, Z.J., and Xin, X.J., 2002, “Finite element analysis for grinding and lapping of wire–sawn silicon wafers,” Journal of Materials Processing Technology, Vol. 129, Nos. 1–3, pp. 2–9.

  40. Hu, P., Zhang, J.M., Pei, Z.J., and Treadwell, C., 2002, “Modeling of material removal rate in rotary ultrasonic machining: designed experiments,” Journal of Materials Processing Technology, Vol. 129, Nos. 1–3, pp. 339–344.

  41. Pei, Z.J., and Strasbaugh, A., 2001, “Fine grinding of silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 41, No. 5, pp. 659–672.

  42. Pei, Z.J., and Ferreira, P.M., 1999, “An experimental investigation of rotary ultrasonic face milling,” International Journal of Machine Tools and Manufacture, Vol. 39, No. 8, pp. 1327–1344.

  43. Pei, Z.J., Billingsley, S.R., and Miura, S, 1999, “Grinding–induced subsurface cracks in silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 39, No. 7, pp. 1103–1116.

  44. Pei, Z.J, and Ferreira, P.M., 1998, “Modeling of ductile mode material removal in rotary ultrasonic machining,” International Journal of Machine Tools and Manufacture, Vol. 38, Nos. 10–11, pp. 1399–1418.

  45. Pei, Z.J., Prabhakar, D., Ferreira, P.M., and Haselkorn, M., 1995, “A mechanistic approach to the prediction of material removal rates in rotary ultrasonic machining,” Journal of Engineering for Industry, Vol. 117, No. 2, pp. 142–151.

  46. Pei, Z.J., Ferreira, P.M., Kapoor, S.G., and Haselkorn, M., 1995, “Rotary ultrasonic machining for face milling of ceramics," International Journal of Machine Tools and Manufacture, Vol. 35, No. 7, pp. 1033–1046.

  47. Pei, Z.J., Ferreira, P.M., and Haselkorn, M., 1995, “Plastic flow in rotary ultrasonic machining of ceramics,” Journal of materials Processing Technology, Vol. 48, Nos. 1–4, pp. 771–777.

  48. Rubenstein, C., Lau, W.S., Pei, Z.J., and Wang, M., 1989, “The torque and thrust arising from contact at the lips in spade drilling of ductile metals,” International Journal of Machine Tools and Manufacture, Vol. 29, No. 3, pp. 453 –467.

 

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PUBLICATIONS IN PEER–REVIEWED TRANSACTIONS AND PROCEEDINGS 

  1. Zhang, X.H., Pei, Z.J., and Fisher, G.R., 2005, “Chemical mechanical polishing of silicon wafers: finite element analysis of wafer flatness,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2005 (IMECE 2005), Orlando, FL, November 6–11.

  2. Churi, N.J., Li, Z.C., Pei, Z.J., and Treadwell, C., 2005, “Rotary ultrasonic machining of titanium alloy: a feasibility study,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2005 (IMECE 2005), Orlando, FL, November 6–11.

  3. Li, Z.C., Pei, Z.J., Zeng, W.M., Kwon, P., and Treadwell, C., 2005, “Preliminary experimental study of rotary ultrasonic machining on zirconia toughened alumina,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 33, pp. 89–96.

  4. Sun, W.P., Pei, Z.J., Lee, S.E., and Fisher, G.R., 2005, “Optimization of process parameters in manufacturing: an ELECTRE approach,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 33, pp. 187–194.

  5. Churi, N.J., and Pei, Z.J., 2004, “Experimental investigations into jig grinding,” Progress of Machining Technology – Proceedings of the Seventh International Conference on Progress of Machining Technology, ICPMT'2004, Suzhou, China, December 8–11, pp.  219–224.

  6. Zeng, W.M., Li, Z.C., Pei, Z.J., and Treadwell, C., 2004, “Tool wear in rotary ultrasonic machining of advanced ceramics,” Progress of Machining Technology – Proceedings of the Seventh International Conference on Progress of Machining Technology, ICPMT'2004, Suzhou, China, December 8–11, pp. 392–397.

  7. Li, Z.C., Cai, L.W., Pei, Z.J., and Treadwell, C., 2004, “Finite element simulation of rotary ultrasonic machining for advanced ceramics,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2004 (IMECE 2004), Anaheim, CA, November 13–19.

  8. Zeng, W.M., Li, Z.C., Pei, Z.J., and Treadwell, C., 2004, “Experimental investigation into rotary ultrasonic machining of alumina,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2004 (IMECE 2004), Anaheim, CA, November 13–19.

  9. Zhang, J.M., Sun, J.G., and Pei, Z.J., 2004, “Optical transmission properties of silicon wafers: theoretical analysis,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2004 (IMECE 2004), Anaheim, CA, November 13–19.

  10. Pei, Z.J., Fisher, G.R., and Strasbaugh, A., 2004, “Fine grinding of silicon wafer: benefits and technical barriers,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 32, pp. 479–488.

  11. Zhang, J.M., Sun, J.G., and Pei, Z.J., 2004, “Optical transmission properties of silicon wafers: experimental study,” Transactions of The North American Manufacturing Research Institution of SME, Vol. 32, pp. 471–478.

  12. Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., 2004, “Experimental study on rotary ultrasonic machining (RUM) of poly crystalline diamond compacts (PDC),” CD–ROM Proceedings of the 13th Annual Industrial Engineering Research Conference (IERC–2004), Houston, TX, May 15–19.

  13. Namala, S., Collins, R., and Pei, Z.J., 2004, “Implementing lean thinking concepts in high product mix manufacturing organizations,” CD–ROM Proceedings of the 13th Annual Industrial Engineering Research Conference (IERC–2004), Houston, TX, May 15–19.

  14. Zhang, J.M., Sun, J.G., and Pei, Z.J., 2003, “Application of laser scattering on detection of subsurface damage in silicon wafers,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2003 (IMECE 2003), Washington, DC, November 16–21, also in American Society of Mechanical Engineers (Publication) NDE, Vol. 24, 2003, pp. 15–24.

  15. Jiao, Y., Wu, J., Lei, S., Pei, Z.J., and Lee, S., 2003, “Application of fuzzy adaptive networks in manufacturing: waviness removal in grinding of wire–sawn silicon wafers,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2003 (IMECE 2003), Washington, DC, November 16–21.

  16. Zhang, J.M., Pei, Z.J., and Sun, J.G., 2003, “Calibration tests of laser scattering in subsurface damage measurements,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 31, pp. 563–570, also SME Technical Paper, MS03–213, Society of Manufacturing Engineers, Dearborn, MI.

  17. Zhang, J.M., Pei, Z.J., and Sun, J.G., 2003, “Experimental study on set–up parameters of laser scattering system,” CD–ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC–2003), Portland, OR, May 18–20.

  18. Hu, P., Wilson, C., and Pei, Z.J., 2003, “An experimental investigation into machinability of a refractory composite material,” CD–ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC–2003), Portland, OR, May 18–20.

  19. Hanna, S., Deines, T., Menon, S., Lei, S., and Pei, Z.J., 2003, “Experimental assessment of machining processes for a new composite material,” CD–ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC–2003), Portland, OR, May 18–20.

  20. Wu. J., Sun, X.K., Pei, Z.J., and Xin, X.J., 2003, “Soft–pad grinding of wire–sawn silicon wafers: finite element analysis using 25 factorial design,” CD–ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC–2003), Portland, OR, May 18–20.

  21.  Jiao, Y., Pei, Z.J., Lei, S., and, Lee, E.S., 2003, “Fuzzy adaptive networks in the modeling and forecasting of manufacturing processes,” CD–ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC–2003), Portland, OR, May 18–20.

  22. Pei, Z.J., and Strasbaugh, A., 2002, “Fine grinding of silicon wafers: grinding marks,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2002 (IMECE 2002), Vol. 2, New Orleans, LA, November 17–22.

  23. Xin, X.J., Pei, Z.J., and Liu, W.J., 2002, “Finite element analysis on soft–pad grinding of wire–sawn silicon wafers,” CD–ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2002 (IMECE 2002), Vol. 2, New Orleans, LA, November 17–22.

  24. Zhang, J.M., Pei, Z.J., and Sun, J.G., 2002, "Measurement of subsurface damage in silicon wafers," Proceedings of the 6th International Conference on Progress of Machining Technology (ICPMT6), Xi'an, Shanxi, China, September 10–14, pp. 715–720.

  25. Chidambaram, S., Pei, Z.J., and Yu, Q.X., 2002, “Back grinding of silicon wafers,” Proceedings of the 6th International Conference on Progress of Machining Technology (ICPMT6), Xi'an, Shanxi, China, September 10–14, pp. 301–306.

  26. Zhang, J.M., Sun, J.G., and Pei, Z.J., 2002, “Subsurface damage measurement in silicon wafers by laser scattering,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 30, pp. 535–542, also SME Technical Paper, MS02–173, Society of Manufacturing Engineers, Dearborn, MI.

  27. Pei, Z.J., and Fisher, G., 2001, “Surface grinding in silicon wafer manufacturing,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 29, pp. 279–286, also SME Technical Paper, MR01–271, Society of Manufacturing Engineers, Dearborn, MI.

  28. Pei, Z.J., Prabhakar, D., Ferreira, P.M., and Haselkorn, M., 1995, “Rotary ultrasonic drilling and milling of ceramics,” Ceramic Transactions, Vol. 49, Manufacture of Ceramic Components, American Ceramic Society, Westerville, OH, pp. 185–196.

  29. Pei, Z.J., Khanna, N., and Ferreira, P.M., 1995, “An investigation into rotary ultrasonic machining of structural ceramics: a review,” Ceramic Engineering and Science Proceedings, Vol. 16, No. 1, pp. 259–278.

  30. Khanna, N., Pei, Z.J., and Ferreira, P.M., 1995, “An experimental investigation of rotary ultrasonic grinding of ceramic disks,” Technical Papers of the North American Manufacturing Research Institution of SME, pp. 67–72, also SME Technical Paper, MR95–141, Society of Manufacturing Engineers, Dearborn, MI.

  31. Prabhakar, D., Pei, Z.J., Ferreira, P.M., and Haselkorn, M., 1993, “A theoretical model for predicting material removal rates in rotary ultrasonic machining of ceramics,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 21, pp. 167–172.

 

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 PUBLICATIONS IN CONFERENCE PROCEEDINGS AND INDUSTRIAL MAGAZINES

  1. Churi, N.J., Pei, Z.J., and Treadwell, C., 2007, “Experimental investigations on rotary ultrasonic machining of hard-to-machine materials,” accepted to appear in Proceedings of Materials Processing under the Influence of External Fields, 2007 TMS Annual Meeting & Exhibition, Orlando, FL, February 25 - March 1, edited by Q.Y. Han, G. Ludtka, Q.J. Zhai, the Minerals, Metals & Materials Society.

  2. Churi, N.J., Pei, Z.J., and Treadwell, C., 2006, “Rotary ultrasonic machining of titanium alloy (Ti-6Al-4V): effects of tool variables,” Proceedings of the International Conference on Manufacturing Science and Technology ( ICOMAST'06), August 28-30, 2006, Melaka, Malaysia.

  3. Zhang, X.H., Pei, Z.J., and Xin, X.J., 2006, “Soft-pad grinding of wire-sawn wafers: 2005 progress report,” CD–ROM Proceedings of the 2006 NSF Design, Service and Manufacturing Grantees and Research Conference, St. Louis, MO, July 24-27.

  4. Liu, J.H., Pei, Z.J., and Fisher, G.R., 2006, “Fundamental research on silicon wafer fine grinding: 2005 progress report,” CD–ROM Proceedings of the 2006 NSF Design, Service and Manufacturing Grantees and Research Conference, St. Louis, MO, July 24-27.

  5. Lu, W.K., Pei, Z.J., and Sun, J.G., 2006, “Innovative laser-based techniques for characterization of subsurface cracks in semiconductor wafers: progress report,” CD–ROM Proceedings of the 2006 NSF Design, Service and Manufacturing Grantees and Research Conference, St. Louis, MO, July 24-27.

  6. Zhang, X.H., Pei, Z.J., Xin, X.J., and Sun, X.K., 2005, “Three–dimensional FEA of soft–pad grinding of wire–sawn silicon wafers: effects of pad parameters,” CD–ROM Proceedings of the 2005 NSF Design, Service and Manufacturing Grantees and Research Conference, Scottsdale, AZ, January 3–6.

  7. Sun, W.P., Pei, Z.J., and Fisher, G.R., 2005, “Fine grinding of silicon wafers: 2004 progress report,” CD–ROM Proceedings of the 2005 NSF Design, Service and Manufacturing Grantees and Research Conference, Scottsdale, AZ, January 3–6.

  8. Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., 2004, “Rotary ultrasonic machining (RUM) on ceramic matrix composites (CMC): Designed experiments,” Proceedings of the Fifth International Conference on High Temperature Ceramic Matrix Composites (HTCMC–5), Seattle, WA, September 12–16.

  9. Shen, J.D., Pei, Z.J., and Lee, E.S., 2004, “Support vector regression in the analysis of soft–pad grinding of wire–sawn silicon wafers,” Proceedings of the joint meeting of the International Conference on Cybernetics and Information Technologies, Systems and Applications (CITSA 2004) and the 10th International Conference on Information Systems Analysis and Synthesis (ISAS 2004), Orlando, FL, July 21–25.

  10. Pei, Z.J., Xin, X.J., and Sun, X.K., 2004, “Soft–pad grinding of 300 mm wire–sawn silicon wafers: effects of soft pad parameters,” Proceedings of the 6th International Conference on Frontiers of Design and Manufacturing, Xi’an, China, June 21–23.

  11. Zeng, W.M., Li, Z.C., Pei, Z.J., and Treadwell, C., 2004, “Rotary ultrasonic machining of advanced ceramics: effects of coolant,” Proceedings of the 6th International Conference on Frontiers of Design and Manufacturing, Xi’an, China, June 21–23.

  12. Li, Z.C., Treadwell, C., and Pei, Z.J., 2004, “Drilling small holes in hard–to–machine materials by rotary ultrasonic machining,” CD–ROM Proceedings of WESTEC Conference–New Frontiers in Manufacturing Technology, Los Angeles, CA, March 22–25, also SME Technical Paper TP04PUB137, Society of Manufacturing Engineers, Dearborn, MI.

  13. Pei, Z.J., Xin, X.J., Liu, W., Wu, J., Sun, X.K., Simmelink, K., and Fouts, M., 2004, “Soft–pad grinding of wire–sawn silicon wafers: progress report,” CD–ROM Proceedings of the 2004 NSF Design, Service and Manufacturing Grantees and Research Conference, Dallas, TX, January 5–8.

  14. Xin, X.J., Sun, X.K., and Pei, Z.J., 2003, “Grinding of 300 mm silicon wafers: finite element analysis of waviness removal,” Proceedings of the International Conference on Leading Edge Manufacturing in 21th Century (LEM21), Niigata, Japan, November 3–6, 2003.

  15. Treadwell, C, and Pei, Z.J., 2003, “Machining ceramics with rotary ultrasonic machining,” Ceramic Industry, June 2003, pp. 39–42.

  16. Pei, Z.J., Strasbaugh, A., and Puthanangady, T., 2003, “Thermal aspects in grinding of silicon wafers,” Proceedings of the NSF Workshop on Research Needs in Thermal Aspects of Material Removal Processes, Stillwater, OK, June 10–12, pp. 375–380.

  17. Hu, P., Zhang, J.M., Jiao, Y., Pei, Z.J., and Treadwell, C., 2003, “Experimental investigation on coolant effects in rotary ultrasonic machining,” Proceedings of the NSF Workshop on Research Needs in Thermal Aspects of Material Removal Processes, Stillwater, OK, June 10–12, pp. 340–345.

  18. Jiao, Y., Hu, P., Pei, Z.J., Lei, S., and Lee, E.S., 2003, “Application of fuzzy adaptive networks in manufacturing: prediction of material removal rate in rotary ultrasonic machining,” Intelligent Engineering Systems Through Artificial Neural Networks, Vol. 13, Smart Engineering System Design: Neural Networks, Fuzzy Logic, Evolutionary Programming, Complex Systems and Artificial Life – Proceedings of the Artificial Neural Networks in Engineering Conference, St. Louis, MO, November 2–5, 2003, pp. 491–496.

  19. Wu, J., Liu, W.J., Sun, X.K., Xin, X.J., and Pei, Z.J., 2003, “Soft–pad grinding of wire–sawn silicon wafers: finite element analysis using 24 factorial design,” CD–ROM Proceedings of the 2003 NSF Design, Service and Manufacturing Grantees and Research Conference, Birmingham, AL, January 6–9.

  20. Xin, X.J., Liu, W.J., and Pei, Z.J., 2002, “Modeling of waviness reduction in silicon wafer grinding by finite element method,” Proceedings of the International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM 2002), Tempe, AZ, April 10–12, pp. 24–29.

  21. Chidambaram, S. and Pei, Z.J., 2002, “A predictive model for grinding mark patterns in semiconductor wafer grinding,” Proceedings of the International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM 2002), Tempe, AZ, April 10–12, pp. 30–35.

  22. Chidambaram, S. and Pei, Z.J., 2001, “A study of grinding marks in semiconductor wafer grinding,” Proceedings of the 16th American Society for Precision Engineering Annual Meeting, Arlington, VA, November 10–15, pp. 393–396.

  23. Fisher, G., and Pei, Z.J., 1998, “Challenges for 300 mm polished wafer manufacturers,” Silicon Wafer Symposium, Portland, OR, Sept 28–29, pp. J1–J9.

  24. Tricard, M., Kassir, S., Herron, P., and Pei, Z.J., 1998, “New abrasive trends in manufacturing of silicon wafers,” Silicon Machining Symposium, American Society For Precision Engineering, St. Louis, MO, April.

  25. Pei, Z.J., Khanna, N., and Ferreira, P.M., 1995, “A study on material removal mechanisms in rotary ultrasonic machining of ceramics,” Proceedings of the 11th International Symposium for ElectroMachining, ISEM–XI, Lausanne, Switzerland, April 17–21, pp. 839–848.

  26. Shirkey, P.R., Pei, Z.J., and Ferreira, P.M., 1994, “Application of stochastic geometry in characterizing random phenomena in material removal processes,” Proceedings of the First S. M Wu Symposium on Manufacturing Science, Evanston, IL, May 27–28, pp. 177–183.

  27. Pei, Z.J., and Lau, W.S., 1989, “A new model of v–cutting,” Proceedings of the Fourth International Conference on Metal Cutting, Non–Conventional Machining and Their Automation, April, Beijing, China, Vol. 1, pp. C197–202.

  28. Zhou, L.Y., Yu, Q.X., and Pei, Z.J., 1989, “Failure mechanism of the coated carbide tool,” Proceedings of the Fourth International Conference on Metal Cutting, Non–Conventional Machining and Their Automation, Beijing, China, April, Vol. 1, pp. C203–207.

  29. Rubenstein, C., Lau, W.S., Pei, Z.J., and Wang, M., 1989, “Evaluation of cutting forces in spade drill,” Proceedings of the Fourth International Conference on Metal Cutting, Non–Conventional Machining and Their Automation, Beijing, China, April, Vol. 2, pp. C245–262.

  30. Wang, Y.M., Pei, Z.J., and Shen, W.Q., 1987, “On the cutting performance of new types of home–made HSS,” Proceedings of the Third International Conference on Metal Cutting, Non–Conventional Machining and Their Automation, Nanjing, China, May, pp. 1–13.

 

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 EDUCATIONAL PAPERS AND PRESENTATIONS

  1. Pei, Z.J., 2006, “Using Hollywood movies as a supplementary tool to teach manufacturing processes,” CD-ROM Proceedings of the 2006 ASEE Annual Conference & Exposition, June 18-21, 2006, Chicago, IL. (This paper has received a nomination for best paper.)

  2. Zhang, J.M., and Pei, Z.J., 2006, “Experience with interactive methods in manufacturing courses,” CD-ROM Proceedings of the 2006 ASEE Annual Conference & Exposition, June 18-21, 2006, Chicago, IL.

  3. Pei, Z.J. 2006, “Using Hollywood movies as a supplementary lecture tool,” Presentation at the Third Annual K-State Teaching Renewal Retreat, Manhattan, KS, January 9.

  4. Sun, W.P., Zhang, J.M., and Pei, Z.J., 2005, “Enhancement of students’ learning in large classes,” CD–ROM Proceedings of the 40th ASEE Midwest Section Conference and Workshops, Fayetteville, AR, September 14–16.

  5. Sun, W.P., Zhang, J.M., and Pei, Z.J., 2005, “Teaching lean manufacturing by learner-centered methods,” CD–ROM Proceedings of the 40th ASEE Midwest Section Conference and Workshops, Fayetteville, AR, September 14–16.

  6. Pei, Z.J., 2003, “Experience of using multimedia during classroom lectures,” CD–ROM Proceedings of the 38th ASEE Midwest Section Conference and Workshops, Rolla, MO, September 10–12.

  7. Pei, Z.J., and Mayfield, C., 2003, “Extension of classroom to a local manufacturing company,” CD–ROM Proceedings of the 38th ASEE Midwest Section Conference and Workshops, Rolla, MO, September 10–12.

  8. Deines, T., Hanna, S., Pei, Z.J., and Wilson, C., 2002, “Experience of innovations in a manufacturing process laboratory course,” CD–ROM Proceedings of the 37th ASEE Midwest Section Conference and Workshops, Norman, OK, September 12–13.

  9. Pei, Z.J., Hanna, S., Deines, T., and Lei, S., 2002, “Experience in technology–based instruction and active learning for a manufacturing course,” Transactions of the Committee of Manufacturing Engineering Chairs/Coordinators (COMEC), Vol. 1, pp. 38–45, also SME Technical Paper, ED02–259, Society of Manufacturing Engineers, Dearborn, MI.

 

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CONFERENCE PRESENTATIONS AND INVITED TALKS 

  1. Pei, Z.J., 2006, “Silicon wafer grinding and rotary ultrasonic machining,” invited talk to the Key Laboratory for Advanced Ceramics and Machining Technology of Ministry of Education, School of Mechanical Engineering, Tianjin University, China, May 23.

  2. Pei, Z.J., 2006, “Tips on writing ‘high-quality’ journal papers,” invited talk to the Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education, School of Mechanical Engineering, Dalian University of Technology, China, May 20.

  3. Pei, Z.J., 2006, “Graduate Education at Kansas State University and silicon wafer grinding,” invited talk to the Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education, School of Mechanical Engineering, Dalian University of Technology, China, May 18.

  4. Pei, Z.J., 2006, “Engineering undergraduate education in the USA,” invited talk to School of Mechanical Engineering, Zhengzhou University, China, May 15.

  5. Pei, Z.J., 2006, “Challenges in grinding of silicon wafers,” invited talk to the Key Laboratory for Stone Machining of Fujian Providence, School of Mechanical Engineering, Huaqiao University, Quanzhou, China, May 12.

  6. Pei, Z.J., 2006, “Manufacturing research and education in the USA,” invited talk to School of Mechanical Engineering, Zhengzhou University, China, May 11.

  7. Pei, Z.J., 2006, “Machine configurations for silicon wafer grinding,” Mechanical & Materials Engineering Symposium, Washington State University, April 13.

  8. Pei, Z.J., 2006, “Grinding wheels for manufacturing of silicon wafers: a literature review,” invited talk to MEMC Electronic Materials, Inc., St. Peters, MO, January 5.

  9. Pei, Z.J., 2005, “Advancement on silicon wafer grinding,” invited talk to Manufacturing Engineering Seminar, Worcester Polytechnic University, November 17.

  10. Lu, W.K., Pei, Z.J., and Fisher, G.R., 2005, “Decomposition analysis of surface features on ground silicon wafers,” presentation at the International Mechanical Engineering Congress and Exposition 2005 (IMECE 2005), Orlando, FL, November 6–11.

  11. Pei, Z.J., 2005, “Challenges in grinding of silicon wafers,” invited talk to Diamond Innovations, Inc., Worthington, OH, July 26.

  12. Pei, Z.J., 2005, “Research issues in wafer grinding and rotary ultrasonic machining,” presentation at the NSF Workshop on Science and Technologies for Manufacturing Machines and Processes, Lincoln, NE, July 19–21.

  13. Pei, Z.J., 2005, “Machine configurations for spindle angle adjustments in silicon wafer grinding,” invited talk to the Northboro Research and Development Center of Saint–Gobain, Northboro, MA, June 21.

  14. Pei, Z.J., 2005, “Central dimples and bumps on ground silicon wafers,” invited talk to the Northboro Research and Development Center of Saint–Gobain, Northboro, MA, May 26.

  15. S. Udayagiri, and Pei, Z.J., 2004, “Value stream analysis in a manufacturing company,” presentation at the INFORMS Annual Meeting, Denver, CO, October 24–27.

  16. Pei, Z.J., 2003, “Fine grinding of silicon wafer: benefits and challenges,” invited talk to Saint–Gobain Abrasives, Inc., Worcester, MA, August 7.

  17. Pei, Z.J., Hanna, S., and Liu, D., 2002, “Interventions and Kaizen events,” two–week long training at Shunde Special Transformer Works, Shunde, Guangdong, China, July 29 – August 9.

  18. Pei, Z.J., and Hanna, S., 2002, “Interventions,” invited talk to Beijing Zhongli Chemical Fiber Machinery Co., Ltd., Beijing, China, July 26.

  19. Pei, Z.J., 2002, “Technology–based instruction and active learning for a manufacturing course,” invited talk to the Industrial Engineering Department at Tsinghua University, Beijing, China, July 25.

  20. Pei, Z.J., 2002, “Challenges in fine grinding of silicon wafers,” invited talk to the Industrial Engineering Department at Tsinghua University, Beijing, China, July 25.

  21. Pei, Z.J., 2002, “Process–induced subsurface damage and waviness in silicon wafers,” invited talk to the Manufacturing Metrology Division of the Manufacturing Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, May 17.

  22. Pei, Z.J., and Strasbaugh, A., 2002, “Fine grinding of silicon wafers: past and future,” presentation at the ASPE 2002 Spring Topical Meeting – Progress in Precision, Raleigh, NC, April 17–18.

  23. Chidambaram, S., and Pei, Z.J., 2001, “Back grinding of silicon wafers: a review,” presentation at the 103rd American Ceramic Society Annual Meeting and Exposition, Indianapolis, IN, April 22–25.

  24. Pei, Z.J., Khanna, N., Ferreira, P.M., and Haselkorn, M., 1995, “Rotary ultrasonic face milling of magnesia stabilized zirconia,” presentation at the American Ceramic Society 97th Annual Meeting, Cincinnati, OH, April 30–May 3.

 

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BOOK CHAPTERS 

[1]     Ferreira, P.M, and Pei, Z.J., 1999, “Rotary ultrasonic machining of ceramics,” A Book Chapter in Machining of Ceramics and Components, edited by S. Jahanmir, M. Ramulu and P. Koshy, Marcel Dekker, Inc. New York, NY.

 

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PATENTS 

  1. U.S. Patent 6,600,557, July 29, 2003, “Method for the detection of processing–induced defects in a silicon wafer” (with A. Stefanescu, H. Erk, and T. Doane).

  2. U.S. Patent 6,114,245, September 5, 2000, “Method of processing semiconductor wafers,” (with R. Vandamme, and Y. Xin).

  3. U.S. Patent 5,655,956, August 12, 1997, “Rotary ultrasonic grinding apparatus and process,” (with P.M. Ferreira and N. Khanna).

  4. US Patent Application (Serial No. 09/512,529), February 24, 2000, “A method of processing semiconductor wafers,” (with S. Miura, A. Desai, and H. Erk).

 

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 BOOK REVIEWS 

  1. Pei Z.J., 2004, “The success of 7–eleven Japan: Discovering the secrets of the world's best–run convenience chain stores,” Journal of the Operational Research Society, Vol. 55, No. 1, p. 99.

 

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 DISSERTATIONS DIRECTED

  1. Li, Z.C., 2006, “Modeling, analysis, and experimental investigations of grinding processes,” Ph.D. thesis (nine papers published from this research).

  2. Zhang, J.M., 2006, “Laser scattering techniques for subsurface damage measurements: system development, experimental investigation, and theoretical analysis,” Ph.D. thesis (nine papers published from this research).

  3. Sun, W.P., 2005, “Grinding of silicon wafers: wafer shape model and its applications,” Ph.D. thesis (six papers published from this research).

  4. Hu, P., 2004, “Exploration of new territories for rotary ultrasonic machining,” MS thesis (five papers published from this research).

  5. Wu, J., 2003, “Soft–pad grinding of wire–sawn silicon wafers: finite element analysis with designed experiments,” MS thesis (five papers published from this research).

  6. Chidambaram. S., 2002, “Mathematical models for predicting grinding marks and chuck shape in semiconductor wafer grinding,” MS thesis (five papers published from this research).

 

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