[1] NSF (National Science Foundation), “CAREER: Fundamental research on silicon wafer fine grinding to foster a quantum leap in manufacturing of silicon wafers” (2/2004 – 1/2009).

[2] NSF (National Science Foundation), “Soft-pad grinding of wire-sawn silicon wafers” (9/2002 – 8/2005). Co-PIs: X.J. Xin (KSU), and S. Ostapenko (University of South Florida).

[3] Argonne National Laboratory/Department of Energy, “Laser-based techniques to detect defects and machining damage in ceramic components and silicon wafers” (6/2003 – 6/2005).

[4] GE Panametrics, “Development of new ultrasonic techniques” (6/2003 – 8/2004).

[5] Strasbaugh, Inc., “Wafer grinding” (6/2003 – 12/2004).

[6] Desano, Inc., “Reengineering business model: improving efficiency, productivity and decreasing cost” (2/2004 – 8/2004).

Completed projects:

[1] SME (Society of Manufacturing Engineers) 2002 Research Initiation Award, “Exploration of new territories for rotary ultrasonic machining” (5/2002 – 12/2003). Co-PI: S. Hanna (KSU)

[2] Argonne National Laboratory/Department of Energy, “Laser scattering measurement of subsurface damage in silicon wafers and ceramic materials” (5/2002 – 12/2002).

[3] GE Panametrics, “Stress analysis on spoolpieces by finite element analysis (FEA)” (9/2003 – 12/2003). Co-PI: X.J. Xin.

[4] Advanced Manufacturing Institute, “Ultrasonic vibration assistant grinding” (7/2003 – 6/2004).

[5] Advanced Manufacturing Institute, “Ultrasonic vibration assistant grinding” (7/2002 – 6/2003). Co-PI: S. Hanna (KSU).

[6] Advanced Manufacturing Institute, “Wafer grinding” (7/2001 – 6/2002).

[7] Advanced Manufacturing Institute, “Wafer grinding” (7/2000 – 6/2001).

PATENTS

[1] U.S. Patent 6,600,557, July 29, 2003, “Method for the detection of processing-induced defects in a silicon wafer” (with A. Stefanescu, H. Erk, and T. Doane).

[2] U.S. Patent 6,114,245, September 5, 2000, “Method of processing semiconductor wafers,” (with R. Vandamme, and Y. Xin) .

[3] U.S. Patent 5,655,956, August 12, 1997, “Rotary ultrasonic grinding apparatus and process,” (with P.M. Ferreira and N. Khanna).

[4] US Patent Application (Serial No. 09/512,529), February 24, 2000, “A method of processing semiconductor wafers,” (with S. Miura, A. Desai, and H. Erk).

BOOK CHAPTER

[1] Ferreira, P.M, and Pei, Z.J., 1999, " Rotary ultrasonic machining of ceramics," A Book Chapter in Machining of Ceramics and Components, edited by S. Jahanmir, M. Ramulu and P. Koshy, Marcel Dekker, Inc. New York, NY.

JOURNAL PUBLICATIONS

[1] Sun, W.P., Pei, Z.J., and Fisher, G.R., 2004, “Fine grinding of silicon wafers: machine configurations for spindle angle adjustments,” accepted to appear in International Journal of Machine Tools and Manufacture.

[2] Jiao, Y., Lei, S., Pei, Z.J., and Lee, E.S., 2004, “Fuzzy adaptive networks in machining process modeling: surface roughness prediction for turning operations,” accepted to appear in International Journal of Machine Tools and Manufacture.

[3] Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., “Development of an innovative coolant system for rotary ultrasonic machining,” conditionally accepted to appear in International Journal of Manufacturing Technology and Management.

[4] Sun, X.K., Pei, Z.J., and Xin, X.J., 2004, “Waviness removal in grinding of wire-sawn silicon wafers: three-dimensional finite element analysis,” accepted to appear in International Journal of Advanced Manufacturing Systems.

[5] Sun, X.K., Xin, X.J., and Pei, Z.J., 2004, “Finite element analysis of die-strength testing configurations for thin semiconductor wafers,” accepted to appear in Journal of Electronic Packaging.

[6] Xin, X.J., Pei, Z.J., and Liu, W.J., 2004, “Finite element analysis on soft-pad grinding of wire-sawn silicon wafers,” Journal of Electronic Packaging, Vol. 126, No. 2, pp. 177-185.

[7] Sun, W.P., Pei, Z.J., and Fisher, G.R., 2004, “Fine grinding of silicon wafers: a mathematical model for the wafer shape,” International Journal of Machine Tools and Manufacture, Vol. 44, No. 7-8, pp. 707-716.

[8] Pei, Z.J., Kassir, S., Bhagavat, M., and Fisher, G.R., 2004, “An experimental investigation into soft-pad grinding of wire-sawn silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 44, No. 2-3, pp. 297-304.

[9] Sun, X.K., Pei, Z.J., Xin, X.J., and Fouts, M., 2004, "Waviness removal in grinding of wire-sawn silicon wafers: 3D finite element analysis with designed experiments," International Journal of Machine Tools and Manufacture, Vol. 44, No. 1, pp. 11-19.

[10] Chidambaram, S., Pei, Z.J., and Kassir, S., 2003, “Fine grinding of silicon wafers: a mathematical model for grinding marks,” International Journal of Machine Tools and Manufacture, Vol. 43, No. 15, pp. 1595-1602.

[11] Chidambaram, S., Pei, Z.J., and Kassir, S., 2003, “Fine grinding of silicon wafers: a mathematical model for the chuck shape,” International Journal of Machine Tools and Manufacture, Vol. 43, No. 7, pp. 739-746.

[12] Pei, Z.J., Xin, X.J.,Liu, W.J., 2003, “Finite element analysis for grinding of wire-sawn silicon wafers: a designed experiment,” International Journal of Machine Tools and Manufacture, Vol. 43, No. 1, pp. 7-16.

[13] Pei, Z.J., 2002, “A Study on surface grinding of 300 mm silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 42, No. 3, pp. 385-393.

[14] Pei, Z.J., and Strasbaugh, A., 2002, “Fine grinding of silicon wafers: designed experiments,” International Journal of Machine Tools and Manufacture, Vol. 42, No. 3, pp. 395-404.

[15] Liu, W.J., Pei, Z.J., and Xin, X.J., 2002, “Finite element analysis for grinding and lapping of wire-sawn silicon wafers,” Journal of Materials Processing Technology, Vol. 129, No. 1-3, pp. 2-9.

[16] Hu, P., Zhang, J.M., Pei, Z.J., Treadwell, C., 2002, “Modeling of material removal rate in rotary ultrasonic machining: designed experiments,” Journal of Materials Processing Technology, Vol. 129, No. 1-3, pp. 339-344.

[17] Pei, Z.J., and Strasbaugh, A., 2001, “Fine grinding of silicon wafers,” International Journal of Machine Tools and Manufacture, Vol. 41, No. 5, pp. 659-672.

[18] Pei, Z.J., and Ferreira, P.M., 1999, "An experimental investigation of rotary ultrasonic face milling," International Journal of Machine Tools and Manufacture, Vol. 39, No. 8, pp. 1327-1344.

[19] Pei, Z.J., Billingsley, S.R., and Miura, S, 1999, "Grinding-induced subsurface cracks in silicon wafers," International Journal of Machine Tools and Manufacture, Vol. 39, No. 7, pp. 1103-1116.

[20] Pei, Z.J, and Ferreira, P.M., 1998, "Modeling of ductile mode material removal in rotary ultrasonic machining," International Journal of Machine Tools and Manufacture, Vol. 38, No. 10-11, pp. 1399-1418.

[21] Pei, Z.J., Prabhakar, D., Ferreira, P.M., and Haselkorn, M., 1995, "A mechanistic approach to the prediction of material removal rates in rotary ultrasonic machining," Journal of Engineering for Industry, Vol. 117, No. 2, pp. 142-151.

[22] Pei, Z.J., Ferreira, P.M., Kapoor, S.G., and Haselkorn, M., 1995, "Rotary ultrasonic machining for face milling of ceramics," International Journal of Machine Tools and Manufacture, Vol. 35, No. 7, pp. 1033-1046.

[23] Pei, Z.J., Ferreira, P.M., and Haselkorn, M., 1995, "Plastic flow in rotary ultrasonic machining of ceramics," Journal of materials Processing Technology, Vol. 48, No. 1-4, pp. 771-777.

[24] Rubenstein, C., Lau, W.S., Pei, Z.J., and Wang, M., 1989, "The torque and thrust arising from contact at the lips in spade drilling of ductile metals," International Journal of Machine Tools and Manufacture, Vol. 29, No. 3, pp. 453 -467.

PUBLICATIONS IN PEER-REVIEWED TRANSACTIONS AND PROCEEDINGS

[1] Pei, Z.J., Fisher, G.R., and Strasbaugh, A., 2004, “Fine grinding of silicon wafer: benefits and technical barriers,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 32, pp. 479-488.

[2] Zhang, J.M., Sun, J.G., and Pei, Z.J., 2004, “Optical transmission properties of silicon wafers: experimental study,” Transactions of The North American Manufacturing Research Institution of SME, Vol. 32, pp. 471-478.

[3] Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., 2004, “Experimental study on rotary ultrasonic machining (RUM) of poly crystalline diamond compacts (PDC),” CD-ROM Proceedings of the 13th Annual Industrial Engineering Research Conference (IERC-2004), Houston, TX, May 15-19, 2004.

[4] Namala, S., Collins, R., and Pei, Z.J., 2004, “Implementing lean thinking concepts in a high product mix manufacturing organization,” CD-ROM Proceedings of the 13th Annual Industrial Engineering Research Conference (IERC-2004), Houston, TX, May 15-19, 2004.

[5] Zhang, J.M., Sun, J.G., and Pei, Z.J., 2003, "Application of laser scattering on detection of subsurface damage in silicon wafers," CD-ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2003 (IMECE 2003), Washington, DC, November 16-21.

[6] Jiao, Y., Wu, J., Lei, S., Pei, Z.J., and Lee, S., 2003, “Application of fuzzy adaptive networks in manufacturing: waviness removal in grinding of wire-sawn silicon wafers,” CD-ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2003 (IMECE 2003), Washington, DC, November 16-21.

[7] Zhang, J.M., Pei, Z.J., and Sun, J.G., 2003, “Calibration tests of laser scattering in subsurface damage measurements,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 31, pp. 563-570, also SME Technical Paper, MS03-213, Society of Manufacturing Engineers, Dearborn, MI.

[8] Zhang, J.M., Pei, Z.J., and Sun, J.G., 2003, “Experimental study on set-up parameters of laser scattering system,” CD-ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC-2003), Portland, OR, May 18-20.

[9] Hu, P., Wilson, C., and Pei, Z.J., 2003, “An experimental investigation into machinability of a refractory composite material,” CD-ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC-2003), Portland, OR, May 18-20.

[10] Hanna, S., Deines, T., Menon, S., Lei, S., and Pei, Z.J., 2003, “Experimental assessment of machining processes for a new composite material,” CD-ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC-2003), Portland, OR, May 18-20.

[11] Wu. J., Sun, X.K., Pei, Z.J., and Xin, X.J., 2003, “Soft-pad grinding of wire-sawn silicon wafers: finite element analysis using 2⁵ factorial design,” CD-ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC-2003), Portland, OR, May 18-20.

[12] Jiao, Y., Pei, Z.J., Lei, S., and, Lee, E.S., 2003, “Fuzzy adaptive networks in the modeling and forecasting of manufacturing processes,” CD-ROM Proceedings of the 12th Annual Industrial Engineering Research Conference (IERC-2003), Portland, OR, May 18-20.

[13] Pei, Z.J., and Strasbaugh, A., 2002, “Fine grinding of silicon wafers: grinding marks,” CD-ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2002 (IMECE 2002), Vol. 2, New Orleans, LA, November 17-22.

[14] Xin, X.J., Pei, Z.J., and Liu, W.J., 2002, “Finite element analysis on soft-pad grinding of wire-sawn silicon wafers,” CD-ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2002 (IMECE 2002), Vol. 2, New Orleans, LA, November 17-22.

[15] Zhang, J.M., Pei, Z.J., and Sun, J.G., 2002, "Measurement of subsurface damage in silicon wafers," Proceedings of the 6th International Conference on Progress of Machining Technology (ICPMT6), Xi'an, Shanxi, China, September 10-14, pp. 715-720.

[16] Chidambaram, S., Pei, Z.J., and Yu, Q.X., 2002, “Back grinding of silicon wafers,” Proceedings of the 6th International Conference on Progress of Machining Technology (ICPMT6), Xi'an, Shanxi, China, September 10-14, pp. 301-306.

[17] Zhang, J.M., Sun, J.G., and Pei, Z.J., 2002, "Subsurface damage measurement in silicon wafers by laser scattering," Transactions of the North American Manufacturing Research Institution of SME, Vol. 30, pp. 535-542, also SME Technical Paper, MS02-173, Society of Manufacturing Engineers, Dearborn, MI.

[18] Pei, Z.J., and Fisher, G., 2001, “Surface grinding in silicon wafer manufacturing,” Transactions of the North American Manufacturing Research Institution of SME, Vol. 29, pp. 279-286, also SME Technical Paper, MR01-271, Society of Manufacturing Engineers, Dearborn, MI.

[19] Pei, Z.J., Prabhakar, D., Ferreira, P.M., and Haselkorn, M., 1995, "Rotary ultrasonic drilling and milling of ceramics," Ceramic Transactions, Vol. 49, Manufacture of Ceramic Components, American Ceramic Society, Westerville, OH, pp. 185-196.

[20] Pei, Z.J., Khanna, N., and Ferreira, P.M., 1995, "An investigation into rotary ultrasonic machining of structural ceramics -- a review," Ceramic Engineering and Science Proceedings, Vol. 16, No. 1, pp. 259-278.

[21] Khanna, N., Pei, Z.J., and Ferreira, P.M., 1995, "An experimental investigation of rotary ultrasonic grinding of ceramic disks," Technical Papers of the North American Manufacturing Research Institution of SME, pp. 67-72, also SME Technical Paper, MR95-141, Society of Manufacturing Engineers, Dearborn, MI.

[22] Prabhakar, D., Pei, Z.J., Ferreira, P.M., and Haselkorn, M., 1993, "A theoretical model for predicting material removal rates in rotary ultrasonic machining of ceramics," Transactions of the North American Manufacturing Research Institution of SME, Vol. 21, pp. 167-172.

PUBLICATIONS IN CONFERENCE PROCEEDINGS AND INDUSTRIAL MAGAZINES

[1] Li, Z.C., Jiao, Y., Deines, T.W., Pei, Z.J., and Treadwell, C., “Rotary ultrasonic machining (RUM) on ceramic matrix composites (CMC): Designed experiments,” accepted to appear in the Proceedings of the Fifth International Conference on High Temperature Ceramic Matrix Composites (HTCMC-5), Seattle, WA, September 12-16, 2004.

[2] Pei, Z.J., Xin, X.J., and Sun, X.K., 2004, “Soft-pad grinding of 300 mm wire-sawn silicon wafers: effects of soft pad parameters,” Proceedings of the 6th International Conference on Frontiers of Design and Manufacturing, Xi’an, China, June 21–23.

[3] Zeng, W.M., Li, Z.C., Pei, Z.J., and Treadwell, C., 2004, “Rotary ultrasonic machining of advanced ceramics: effects of coolant,” Proceedings of the 6th International Conference on Frontiers of Design and Manufacturing, Xi’an, China, June 21–23.

[4] Li, Z.C., Treadwell, C., and Pei, Z.J., 2004, “Drilling small holes in hard-to-machine materials by rotary ultrasonic machining,” CD-ROM Proceedings of WESTEC Conference – New Frontiers in Manufacturing Technology, Los Angeles, CA, March 22-25, also SME Technical Paper, TP04PUB137, Society of Manufacturing Engineers, Dearborn, MI.

[5] Pei, Z.J., Xin, X.J., Liu, W., Wu, J., Sun, X.K., Simmelink, K., and Fouts, M., 2004, “Soft-pad grinding of wire-sawn silicon wafers: progress report,” CD-ROM Proceedings of the 2004 NSF Design, Service and Manufacturing Grantees and Research Conference, Dallas, TX, January 5-8.

[6] Pei, Z.J., 2003, “Experience of using multimedia during classroom lectures,” CD-ROM Proceedings of the 38th ASEE Midwest Section Conference and Workshops, Rolla, MO, September 10-12.

[7] Pei, Z.J., and Mayfield, C., 2003, “Extension of classroom to a local manufacturing company,” CD-ROM Proceedings of the 38th ASEE Midwest Section Conference and Workshops, Rolla, MO, September 10-12.

[8] Xin, X.J., Sun, X.K., and Pei, Z.J., 2003, “Grinding of 300 mm silicon wafers: finite element analysis of waviness removal,” Proceedings of the International Conference on Leading Edge Manufacturing in 21th Century (LEM21), Niigata, Japan, November 3-6, 2003.

[9] Treadwell, C, and Pei, Z.J., 2003, “Machining ceramics with rotary ultrasonic machining,” Ceramic Industry, June 2003, pp. 39-42.

[10] Pei, Z.J., Strasbaugh, A., and Puthanangady, T., 2003, “Thermal aspects in grinding of silicon wafers,” Proceedings of the NSF Workshop on Research Needs in Thermal Aspects of Material Removal Processes, Stillwater, OK, June 10-12, pp. 375-380.

[11] Hu, P., Zhang, J.M., Jiao, Y., Pei, Z.J., and Treadwell, C., 2003, “Experimental investigation on coolant effects in rotary ultrasonic machining,” Proceedings of the NSF Workshop on Research Needs in Thermal Aspects of Material Removal Processes, Stillwater, OK, June 10-12, pp. 340-345.

[12] Y. Jiao, P. Hu, Z.J. Pei, S. Lei, and E.S. Lee, 2003, “Application of fuzzy adaptive networks in manufacturing: prediction of material removal rate in rotary ultrasonic machining,” Proceedings of ANNIE 2003 (Artificial Neural Networks In Engineering), St. Louis, MO, November 2-5.

[13] Wu, J., Liu, W.J., Sun, X.K., Xin, X.J., and Pei, Z.J., 2003, “Soft-pad grinding of wire-sawn silicon wafers: finite element analysis using 2⁴ factorial design,” CD-ROM Proceedings of the 2003 NSF Design, Service and Manufacturing Grantees and Research Conference, Birmingham, AL, January 6-9.

[14] Deines, T., Hanna, S., Pei, Z.J., and Wilson, C., 2002, “Experience of innovations in a manufacturing process laboratory course,” CD-ROM Proceedings of the 37th ASEE Midwest Section Conference and Workshops, Norman, OK, September 12-13.

[15] Pei, Z.J., Hanna, S., Deines, T., and Lei, S., 2002, “Experience in technology-based instruction and active learning for a manufacturing course,” Transactions of the Committee of Manufacturing Engineering Chairs/Coordinators (COMEC), Vol. 1, pp. 38-45, also SME Technical Paper, ED02-259, Society of Manufacturing Engineers, Dearborn, MI.

[16] Xin, X.J., Liu, W.J., and Pei, Z.J., 2002, “Modeling of waviness reduction in silicon wafer grinding by finite element method,” Proceedings of the International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM 2002), Tempe, AZ, April 10-12, pp. 24-29.

[17] Chidambaram, S. and Pei, Z.J., 2002, “A predictive model for grinding mark patterns in semiconductor wafer grinding,” Proceedings of the International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM 2002), Tempe, AZ, April 10-12, pp. 30-35.

[18] Chidambaram, S. and Pei, Z.J., 2001, “A study of grinding marks in semiconductor wafer grinding,” Proceedings of the 16th American Society for Precision Engineering Annual Meeting, Arlington, VA, November 10–15, pp. 393-396.

[19] Fisher, G., and Pei, Z.J., 1998, “Challenges for 300 mm polished wafer manufacturers,” Silicon Wafer Symposium, Portland, OR, Sept 28-29, pp. J1-J9.

[20] Tricard, M., Kassir, S., Herron, P., and Pei, Z.J., 1998, “New abrasive trends in manufacturing of silicon wafers,” Silicon Machining Symposium, American Society For Precision Engineering, St. Louis, MO, April.

[21] Pei, Z.J., Khanna, N., and Ferreira, P.M., 1995, "A study on material removal mechanisms in rotary ultrasonic machining of ceramics," Proceedings of the 11th International Symposium for ElectroMachining, ISEM-XI, Lausanne, Switzerland, April 17-21, pp. 839-848.

[22] Shirkey, P.R., Pei, Z.J., and Ferreira, P.M., 1994, "Application of stochastic geometry in characterizing random phenomena in material removal processes," Proceedings of the First S. M Wu Symposium on Manufacturing Science, Evanston, IL, May 27-28, pp. 177-183.

[23] Pei, Z.J., and Lau, W.S., 1989, "A new model of v-cutting," Proceedings of the Fourth International Conference on Metal Cutting, Non-Conventional Machining and Their Automation, April, Beijing, China, Vol. 1, pp. C197-202.

[24] Zhou, L.Y., Yu, Q.X., and Pei, Z.J., 1989, "Failure mechanism of the coated carbide tool," Proceedings of the Fourth International Conference on Metal Cutting, Non-Conventional Machining and Their Automation, Beijing, China, April, Vol. 1, pp. C203-207.

[25] Rubenstein, C., Lau, W.S., Pei, Z.J., and Wang, M., 1989, "Evaluation of cutting forces in spade drill," Proceedings of the Fourth International Conference on Metal Cutting, Non-Conventional Machining and Their Automation, Beijing, China, April, Vol. 2, pp. C245-262.

[26] Wang, Y.M., Pei, Z.J., and Shen, W.Q., 1987, "On the cutting performance of new types of home-made HSS," Proceedings of the Third International Conference on Metal Cutting, Non-Conventional Machining and Their Automation, Nanjing, China, May, pp. 1-13.

CONFERENCE PRESENTATIONS AND INVITED TALKS

[1] Pei, Z.J., 2003, “Fine grinding of silicon wafer: benefits and challenges,” invited talk to Saint-Gobain Abrasives, Inc., Worcester, MA, August 7.

[2] Pei, Z.J., Hanna, S., and Liu, D., 2002, “Interventions and Kaizen events,” two-week long training at Shunde Special Transformer works, Shunde, Guangdong, China, July 29 – August 9.

[3] Pei, Z.J., and Hanna, S., 2002, “Interventions,” invited talk to Beijing Zhongli Chemical Fiber Machinery Co., Ltd., Beijing, China, July 26.

[4] Pei, Z.J., 2002, “Technology-based instruction and active learning for a manufacturing course,” invited talk to the Industrial Engineering Department at Tsinghua University, Beijing, China, July 25.

[5] Pei, Z.J., 2002, “Challenges in fine grinding of silicon wafers,” invited talk to the Industrial Engineering Department at Tsinghua University, Beijing, China, July 25.

[6] Pei, Z.J., 2002, “Process-induced subsurface damage and waviness in silicon wafers,” invited talk to the Manufacturing Metrology Division of the Manufacturing Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD, May 17.

[7] Pei, Z.J., and Strasbaugh, A., 2002, “Fine grinding of silicon wafers: past and future,” presentation at the ASPE 2002 Spring Topical Meeting – Progress in Precision, Raleigh, NC, April 17-18.

[8] Chidambaram, S., and Pei, Z.J., 2001, “Back grinding of silicon wafers: a review,” presentation at the 103rd American Ceramic Society Annual Meeting and Exposition, Indianapolis, IN, April 22-25.

[9] Pei, Z.J., Khanna, N., Ferreira, P.M., and Haselkorn, M., 1995, "Rotary ultrasonic face milling of magnesia stabilized zirconia," presentation at the American Ceramic Society 97th Annual Meeting, Cincinnati, OH, April 30-May 3.

RESEARCH ASSOCIATES (STUDENTS, VISITNG SCHOLARS, AND POST-DOCS, ETC.)

Zinc Li (Ph.D. student)

Vicky Lu (Ph.D. student, starting Aug. 2004)

Wangping Sun (Ph.D. student)

Budong Yang (Ph.D. student, currently conducting thesis research at Denaso, Inc.)

Jenny Zhang (Ph.D. student, currently conducting thesis research at Argonne National Laboratory)

Xiaohong Zhang (Ph.D. student, starting Aug. 2004)

Nikhil Churi (MS student)

Ping Hu (MS student, conducted research at GE Panametrics, Inc. for one year)

Weimin Zeng (visiting scholar, Huaqiao University, Xiamen, China)

Kelli Simmelink (undergraduate, supported by NSF REU supplement)

Mandy Fouts (teacher at Bergman Elementary school, supported by NSF RET supplement)

Former Associates:

Soma Chidambaram (MS student, graduated in Dec. 2002)

Jessie Wu (MS student, graduated in Dec. 2003)

Wenjie Liu (visiting scholar, currently a Ph.D. student in Mechanical Engineering at KSU)

Dr. Zhongxin Xu (visiting scholar, Tsinghua University, Beijing, China)

Dr. June Jiao (post-doc researcher, currently with University of Massachusetts)

Dr. Xuekun Sun (post-doc researcher, currently with Syracuse University)

Dr. Rachel Zhao (Research scientist, currently working in industry)